EEPROM, 8KX8, Serial, CMOS, PDSO8,
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
包装说明 | SOP, SOP8,.3 |
Reach Compliance Code | unknown |
数据保留时间-最小值 | 100 |
耐久性 | 1000000 Write/Erase Cycles |
I2C控制字节 | 1010DDDR |
JESD-30 代码 | R-PDSO-G8 |
内存密度 | 65536 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
端子数量 | 8 |
字数 | 8192 words |
字数代码 | 8000 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 8KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | SERIAL |
电源 | 3/5 V |
认证状态 | Not Qualified |
串行总线类型 | I2C |
最大待机电流 | 0.000001 A |
最大压摆率 | 0.003 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
写保护 | HARDWARE |
Base Number Matches | 1 |
CAT24FC64GXI-TE13 | CAT24FC64GWE-TE13 | CAT24FC64GYE-TE13 | CAT24FC64GYI-TE13 | CAT24FC64GLE | CAT24FC64GWI | CAT24FC64GXE | CAT24FC64GYE | CAT24FC64GYI | |
---|---|---|---|---|---|---|---|---|---|
描述 | EEPROM, 8KX8, Serial, CMOS, PDSO8, | EEPROM, 8KX8, Serial, CMOS, PDSO8, | EEPROM, 8KX8, Serial, CMOS, PDSO8, | EEPROM, 8KX8, Serial, CMOS, PDSO8, | EEPROM, 8KX8, Serial, CMOS, PDIP8, | EEPROM, 8KX8, Serial, CMOS, PDSO8 | EEPROM, 8KX8, Serial, CMOS, PDSO8 | EEPROM, 8KX8, Serial, CMOS, PDSO8 | EEPROM, 8KX8, Serial, CMOS, PDSO8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | SOP, SOP8,.3 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.3 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow | unknow | unknow | unknow |
数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
I2C控制字节 | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | TSSOP | TSSOP | DIP | SOP | SOP | TSSOP | TSSOP |
封装等效代码 | SOP8,.3 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | DIP8,.3 | SOP8,.25 | SOP8,.3 | TSSOP8,.25 | TSSOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大待机电流 | 0.000001 A | 0.00001 A | 0.00001 A | 0.000001 A | 0.00001 A | 0.000001 A | 0.00001 A | 0.00001 A | 0.000001 A |
最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
表面贴装 | YES | YES | YES | YES | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 0.635 mm | 0.635 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
厂商名称 | - | - | - | - | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved