Telecom Circuit, 1-Func, BICMOS, CDIP28, 0.300 INCH, CERDIP-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | 0.300 INCH, CERDIP-28 |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-GDIP-T28 |
| JESD-609代码 | e0 |
| 长度 | 37.0205 mm |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| CY7B923-DMB | CY7B923-LC | CY7B923-PC | CY7B923-PI | CY7B933-DC | CY7B933-DMB | CY7B933-LC | CY7B933-PC | CY7B933-PI | CY7B923-DC | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Telecom Circuit, 1-Func, BICMOS, CDIP28, 0.300 INCH, CERDIP-28 | Telecom Circuit, 1-Func, BICMOS, CQCC28, LCC-28 | Telecom Circuit, 1-Func, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Telecom Circuit, 1-Func, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Telecom Circuit, 1-Func, BICMOS, CDIP28, 0.300 INCH, CERDIP-28 | Telecom Circuit, 1-Func, BICMOS, CDIP28, 0.300 INCH, CERDIP-28 | Telecom Circuit, 1-Func, BICMOS, CQCC28, LCC-28 | Telecom Circuit, 1-Func, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Telecom Circuit, 1-Func, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Telecom Circuit, 1-Func, BICMOS, CDIP28, 0.300 INCH, CERDIP-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | QLCC | DIP | DIP | DIP | DIP | QLCC | DIP | DIP | DIP |
| 包装说明 | 0.300 INCH, CERDIP-28 | LCC-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, CERDIP-28 | 0.300 INCH, CERDIP-28 | LCC-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, PLASTIC, DIP-28 | 0.300 INCH, CERDIP-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 代码 | R-GDIP-T28 | S-CQCC-N28 | R-PDIP-T28 | R-PDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | S-CQCC-N28 | R-PDIP-T28 | R-PDIP-T28 | R-GDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 37.0205 mm | 11.43 mm | 35.4965 mm | 35.4965 mm | 37.0205 mm | 37.0205 mm | 11.43 mm | 35.4965 mm | 35.4965 mm | 37.0205 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 85 °C | 70 °C | 125 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCN | DIP | DIP | DIP | DIP | QCCN | DIP | DIP | DIP |
| 封装等效代码 | DIP28,.3 | LCC28,.45SQ | DIP28,.3 | DIP28,.3 | DIP28,.3 | DIP28,.3 | LCC28,.45SQ | DIP28,.3 | DIP28,.3 | DIP28,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.9812 mm | 4.826 mm | 4.826 mm | 5.08 mm | 5.08 mm | 1.9812 mm | 4.826 mm | 4.826 mm | 5.08 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | NO | NO | YES | NO | NO | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 11.43 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 11.43 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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