FERROXCUBE
DATA SH
EET
A SHEET
SMD beads
EMI-suppression products
Supersedes data of February 2002
2004 Sep 01
Ferroxcube
EMI-suppression products
SMD BEADS FOR EMI SUPPRESSION
General data
ITEM
SPECIFICATION
Strip material copper (Cu), tin-lead (SnPb) plated,
lead-free (Sn) available on request.
Solderability
Taping
method
Mechanical data
5.3
±
0.35
1.2
min
1.1
min
SMD beads
3.05
±
0.15
1.27
±
0.07
“IEC 60068-2-58”,
Part 2, Test Ta,
method 1
“IEC 60286-3”
,
“EIA 481-1”
and
“EIA 481-2”
0.2
±
0.015
Dimensions in mm.
1.8
max
MBE731
Grades, parameters and type numbers
GRADE
|Z
typ
(Ω)
|
(1)
at f
(MHz)
TYPE NUMBER
Fig.1 BDS 3/1.8/5.3.
BDS 3/1.8/5.3; mass
≈0.1
g
(2)
3S1
28
33
25
4S2
25
38
45
10
25
100
25
100
300
BDS 3/1.8/5.3-4S2
BDS 3/1.8/5.3-3S1
4.6
±
0.3
1.2
min
1.1
min
3.05
±
0.15
1.27
±
0.07
3
max
0.2
±
0.015
Dimensions in mm.
MGC296
BDS 3/3/4.6; mass
≈0.15
g
(2)
3S1
25
45
35
4S2
30
50
55
3
10
25
25
100
300
BDS3/3/4.6-4S2
BDS3/3/4.6-3S1
Fig.2 BDS 3/3/4.6.
8.9
±
0.35
5 min
1.2
min
3
max
3.05
±
0.15
1.27
±
0.07
BDS 3/3/8.9; mass
≈0.3
g
(3)
3S1
55
80
55
4S2
65
100
110
3
10
25
25
100
300
(3)
Dimensions in mm.
BDS 3/3/8.9-3S1
0.2
±
0.015
MGC297
BDS 3/3/8.9-4S2
Fig.3 BDS 3/3/8.9.
BDS 4.6/3/8.9; mass
≈0.5
g
4S2
65
100
110
Note
2. DC resistance
<0.6
mΩ.
3. DC resistance
<1.0
mΩ
2004 Sep 01
8.9
±
0.35
5 min
25
100
300
BDS 4.6/3/8.9-4S2
1.2
min
3
max
4.6
±
0.3
1.27
±
0.07
0.2
±
0.015
min
MGC298
1. Typical values, Z
is
−20%.
Dimensions in mm.
Fig.4 BDS 4.6/3/8.9.
2
Ferroxcube
EMI-suppression products
RECOMMENDED DIMENSIONS OF SOLDER LANDS
Table 1
Reflow soldering
DIMENSIONS (mm)
SIZE
A
BDS 3/1.8/5.3
BDS 3/3/4.6
BDS 3/3/8.9
BDS 4.6/3/8.9
2.8
2.8
7.0
7.0
B
7.2
6.4
10.8
10.8
C
2.2
1.8
1.9
1.9
D
3.3
3.3
3.3
3.3
SMD beads
; ;
B
A
C
C
D
MEA734
For dimensions see Table 1.
Dimensions of solder lands are based on a solder paste layer
thickness of approximately 200
µm
(≈0.7 mg solder paste per mm
2
).
Fig.5 Reflow and vapour phase soldering.
Table 2
Wave soldering
DIMENSIONS (mm)
SIZE
A
BDS 3/1.8/5.3
BDS 3/3/4.6
BDS 3/3/8.9
BDS 4.6/3/8.9
2.0
2.0
6.0
6.0
B
7.2
6.4
12.2
12.2
C
2.6
2.2
3.1
3.1
D
3.0
3.0
3.0
3.0
E
0.8
0.8
2.5
2.5
;;;
B
A
E
C
C
MEA735
D
For dimensions see Table 2.
Fig.6 Wave soldering.
2004 Sep 01
3
Ferroxcube
EMI-suppression products
Soldering profiles
300
SMD beads
10 s
260
°C
245
°C
215
°C
10 s
MLA859
T
(°C)
250
200
180
°C
40 s
150
130
°C
100
2 K/s
50
0
0
50
100
150
200
t (s)
250
Typical values (solid line).
Process limits (dotted lines).
Fig.7 Reflow soldering.
300
10 s
MLA861
T
(°C)
250
235
°C
to 260
°C
second wave
200
first wave
5 K/s
2 K/s
150
200 K/s
100
°C
to 130
°C
100
forced
cooling
50
2 K/s
0
0
50
100
150
200
t (s)
250
Typical values (solid line).
Process limits (dotted lines).
Fig.8 Double wave soldering.
2004 Sep 01
4
Ferroxcube
EMI-suppression products
BLISTER TAPE AND REEL DIMENSIONS
SMD beads
K
handbook, full pagewidth
0
T
D0
P0
P2
E
cover tape
B0
F
W
MEA613 - 1
A0
P1
direction of unreeling
D1
For dimensions see Table 3.
Fig.9 Blister tape.
Table 3
Physical dimensions of blister tape; see Fig.9
DIMENSIONS (mm)
SIZE
BDS3/1.8/5.3
A
0
B
0
K
0
T
W
E
F
D
0
D
1
P
0
P
1
P
2
3.25
±0.1
5.85
±0.1
2.0
±0.1
0.3
±0.05
12.0
±0.3
1.75
±0.1
5.5
±0.05
1.5 +0.1
≥1.5
4.0
±0.1
8.0
±0.1
2.0
±0.1
BDS3/3/4.6
3.45
±0.1
5.1
±0.1
3.1
±0.1
0.25
±10%
12.0
±0.3
1.75
±0.1
5.5
±0.05
1.5 +0.1
≥1.5
4.0
±0.1
8.0
±0.1
2.0
±0.05
BDS3/3/8.9
3.45
±0.1
9.4
±0.1
3.1
±0.1
0.35
±0.05
16.0
±0.3
1.75
±0.1
7.5
±0.1
1.5 +0.1
≥1.5
4.0
±0.1
8.0
±0.1
2.0
±0.1
BDS4.6/3/8.9
5.1
±0.1
9.4
±0.1
3.1
±0.1
0.3
±0.05
16.0
±0.3
1.75
±0.1
7.5
±0.1
1.5 +0.1
≥1.5
4.0
±0.1
8.0
±0.1
2.0
±0.1
2004 Sep 01
5
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