Standard SRAM, 64KX16, 55ns, CMOS, PDSO44, TSOP2-44
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | TSOP2, TSOP44,.46,32 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 55 ns |
| 备用内存宽度 | 8 |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-G44 |
| JESD-609代码 | e1 |
| 长度 | 18.41 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装等效代码 | TSOP44,.46,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大待机电流 | 3e-7 A |
| 最小待机电流 | 1.5 V |
| 最大压摆率 | 0.04 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| Base Number Matches | 1 |
| BS616LV1015EIP55 | BS616LV1015ACP55 | BS616LV1015ECP55 | BS616LV1015ECG55 | BS616LV1015EIG55 | BS616LV1015ACG55 | BS616LV1015AIG55 | BS616LV1015AIP55 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 64KX16, 55ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 55ns, CMOS, PBGA48, MINIBGA-48 | Standard SRAM, 64KX16, 55ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 55ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 55ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 64KX16, 55ns, CMOS, PBGA48, MINIBGA-48 | Standard SRAM, 64KX16, 55ns, CMOS, PBGA48, MINIBGA-48 | Standard SRAM, 64KX16, 55ns, CMOS, PBGA48, MINIBGA-48 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | TSOP2, TSOP44,.46,32 | LFBGA, BGA48,6X8,30 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | LFBGA, BGA48,6X8,30 | LFBGA, BGA48,6X8,30 | LFBGA, BGA48,6X8,30 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-G44 | R-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 18.41 mm | 8 mm | 18.41 mm | 18.41 mm | 18.41 mm | 8 mm | 8 mm | 8 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 48 | 44 | 44 | 44 | 48 | 48 | 48 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| 组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | LFBGA | TSOP2 | TSOP2 | TSOP2 | LFBGA | LFBGA | LFBGA |
| 封装等效代码 | TSOP44,.46,32 | BGA48,6X8,30 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | BGA48,6X8,30 | BGA48,6X8,30 | BGA48,6X8,30 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.4 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大待机电流 | 3e-7 A | 3e-7 A | 3e-7 A | 3e-7 A | 3e-7 A | 3e-7 A | 3e-7 A | 3e-7 A |
| 最小待机电流 | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| 最大压摆率 | 0.04 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.04 mA | 0.035 mA | 0.04 mA | 0.04 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) | Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) | Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) | Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) | Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) | Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) | Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) | Tin/Silver/Copper (Sn95.5Ag3.8Cu0.7) |
| 端子形式 | GULL WING | BALL | GULL WING | GULL WING | GULL WING | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.75 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.75 mm | 0.75 mm | 0.75 mm |
| 端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 10.16 mm | 6 mm | 10.16 mm | 10.16 mm | 10.16 mm | 6 mm | 6 mm | 6 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
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