MADS-002545-1307 Series
SURMOUNT
TM
Schottky Diodes:
Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip
Features
•
Ultra Low Parasitic Capacitance and Inductance
•
Surface Mountable in Microwave Circuits , No
Wire bonds Required
•
Rugged HMIC Construction with Polyimide
Scratch Protection
•
Reliable, Multilayer Metallization with a Diffusion
•
Barrier, 100% Stabilization Bake (300 °C, 16 hours)
•
Lower Susceptibility to ESD Damage
Topview
M/A-COM Products
Rev. V3
A
B
Description and Applications
The MADS-002545-1307 Series Surmount
Silicon Schottky Cross-Over Quad Diodes are fabri-
cated with the patented Heterolithic Microwave Inte-
grated Circuit (HMIC) process. HMIC circuits consist of
Silicon pedestals which form diodes or via conductors em-
bedded in a glass dielectric, which acts as the low disper-
sion, low loss, microstrip transmission medium. The combi-
nation of silicon and glass allows HMIC devices to have
excellent loss and power dissipation characteristics in a low
profile, reliable device.
These Surmount Schottky devices are excellent
choices for circuits requiring the small parasitics of a
beam lead device coupled with the superior mechanical per-
formance of a chip. The Surmount structure employs very low
resistance silicon vias to connect the Schottky contacts to the
metalized mounting pads on the bottom surface of the
chip. These devices are reliable, repeatable, and a
lower cost performance solution to conventional de-
vices. They have lower susceptibility to electrostatic
discharge than conventional beam lead Schottky di-
odes.
The multi-layer metallization employed in the fabrication of the
Surmount Schottky junctions includes a platinum diffu-
sion barrier, which permits all devices to be subjected to a 16-
hour non-operating stabilization bake at 300°C.
The “ 0202 ” outline allows for Surface Mount placement and
multi- functional polarity orientations. The MADS-002545-1307
Series is recommended for use in microwave circuits through
Ku band frequencies for lower power applications such as mix-
ers, sub-harmonic mixers, detectors and limiters. The HMIC
construction facilitates the direct replacement of more fragile
beam lead diodes with the corresponding Surmount diode,
which can be connected to a hard or soft substrate circuit with
solder.
C
D
E
Sideview
D
Case Style 1307
MADS-002545-1307
Equivalent Circuit
Dim
Min.
A
B
C
D Sq.
E Sq.
Inches
Max.
0.025
0.025
0.008
0.009
0.009
0.023
0.023
0.004
0.007
0.007
Millimeters
Min.
Max.
0.575
0.575
0.102
0.175
0.175
0.625
0.625
0.203
0.225
0.225
1
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADS-002545-1307 Series
SURMOUNT
TM
Schottky Diodes:
Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip
Electrical Specifications @ + 25 °C (Measured as Single Diodes)
Model
Number
MADS-002545-1307L
MADS-002545-1307M
MADS-002545-1307H
M/A-COM Products
Rev. V3
Type
Low
Barrier
Medium
Barrier
High
Barrier
Recommended
Frequency Range
DC - 18 GHz
DC - 18 GHz
DC - 18 GHz
Vf @ 1 mA
( mV )
330 Max
305 Typ
470 Max
390 Typ
700 Max
650 Typ
ΔVf
@ 1mA
( mV )
10 Max
10 Max
10 Max
Ct @ 0V
( pF )
0.22 Max
0.11 Typ
0.22 Max
0.11 Typ
0.22 Max
0.11 Typ
Rt Slope Resistance
( Vf1–Vf2 ) /
( 10.5mA – 9.5mA )
(
Ω
)
11 Typical
20 Max
10 Typical
18 Max
9 Typical
15 Max
Rt is the dynamic slope resistance where Rt = Rs + Rj where Rj =26 / Idc ( Idc is in mA ) and Rs is the Ohmic Resistance.
Absolute Maximum Ratings @ 25 °C
1
Handling Procedures
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for individual
components. The top surface of the die has a protective
polyimide coating to minimize damage.
The rugged construction of these Surmount devices
allows the use of standard handling and die attach
techniques. It is important to note that industry standard
electrostatic discharge (ESD) control is required at
all times, due to the sensitive nature of Schottky
junctions. Bulk handling should insure that abrasion
and mechanical shock are minimized.
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Die Bonding Temperature
Forward Current
Reverse Voltage l - 10
μ
A l
RF C.W. Incident Power
RF & DC Dissipated Power
Absolute Maximum
-40 °C to +125 °C
-40 °C to +150 °C
+175 °C
+320 °C for 10 sec.
20 mA
I -5 V I
+20 dBm C.W.
50 mW
Die Bonding
Die attach for these devices is made simple through
the use of surface mount die attach technology.
Mounting pads are conveniently located on the bottom
surface of these devices, and are opposite the active
junction. The devices are well suited for high
temperature solder attachment onto hard substrates.
80Au/20Sn and Sn63/Pb36 solders are
acceptable for usage.
1. Operation of this device above any one of these parameters
may cause permanent damage.
Die Bonding
For Hard substrates, we recommend utilizing a
vacuum tip and force of 60 to 100 grams applied
uniformly to the top surface of the device, using a
hot gas bonder with equal heat applied across the
bottom mounting pads of the device. When soldering
to soft substrates, it is recommended to use a
lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are
aligned with the circuit board mounting pads. Reflow
the solder paste by applying Equal heat to the circuit
at both die-mounting pads. The solder joint must Not
be made one at a time, creating un-equal heat flow
and thermal stress. Solder reflow should Not be
performed by causing heat to flow through the top
surface of the die. Since the HMIC glass is transparent, the
edges of the mounting pads can be visually inspected
through the die after die attach is completed.
2
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MADS-002545-1307 Series
SURMOUNT
TM
Schottky Diodes:
Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip
Circuit Mounting Dimensions ( Inches )
0.012
0.012
M/A-COM Products
Rev. V3
0.012
0.012
0.009
0.009
0.012
0.012
Ordering Information
Part Number
MADS-002545-1307LG
MADS-002545-1307LT
MADS-002545-1307MG
MADS-002545-1307MT
MADS-002545-1307HG
MADS-002545-1307HT
Package
Die in Carrier
Tape/Reel
Die in Carrier
Tape/Reel
Die in Carrier
Tape/Reel
3
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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