OTP ROM, 1MX16, 80ns, CMOS, PDSO48, 0.550 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-48
| 参数名称 | 属性值 |
| 零件包装代码 | TSOP2 |
| 包装说明 | TSOP2, |
| 针数 | 48 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 80 ns |
| 备用内存宽度 | 8 |
| JESD-30 代码 | R-PDSO-G48 |
| 长度 | 19.68 mm |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 宽度 | 13.97 mm |
| Base Number Matches | 1 |

| MSM27C1602CZ-NTS | MSM27C1602CZ-XXRS | MSM27C1602CZ-XXTS | MSM27C1602CZ-XXGS-K | MSM27C1602CZ-NGS-K | MSM27C1602CZ-NRS | |
|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 1MX16, 80ns, CMOS, PDSO48, 0.550 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-48 | OTP ROM, 1MX16, 80ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | OTP ROM, 1MX16, 80ns, CMOS, PDSO48, 0.550 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-48 | OTP ROM, 1MX16, 80ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44 | OTP ROM, 1MX16, 80ns, CMOS, PDSO44, 0.600 INCH, 1.27 MM PITCH, PLASTIC, SOP-44 | OTP ROM, 1MX16, 80ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 |
| 零件包装代码 | TSOP2 | DIP | TSOP2 | SOIC | SOIC | DIP |
| 包装说明 | TSOP2, | DIP, | TSOP2, | SOP, | SOP, | DIP, |
| 针数 | 48 | 42 | 48 | 44 | 44 | 42 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 80 ns | 80 ns | 80 ns | 80 ns | 80 ns | 80 ns |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PDSO-G48 | R-PDIP-T42 | R-PDSO-G48 | R-PDSO-G44 | R-PDSO-G44 | R-PDIP-T42 |
| 长度 | 19.68 mm | 51.98 mm | 19.68 mm | 28.15 mm | 28.15 mm | 51.98 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 42 | 48 | 44 | 44 | 42 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | DIP | TSOP2 | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 5.08 mm | 1.2 mm | 3.1 mm | 3.1 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.8 mm | 2.54 mm | 0.8 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 13.97 mm | 15.24 mm | 13.97 mm | 13 mm | 13 mm | 15.24 mm |
| 厂商名称 | - | OKI | OKI | OKI | OKI | OKI |
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