MA4L
Series
Silicon PIN Limiter Diodes
Features
•
•
•
•
•
•
Low Insertion Loss and Noise Figure
High Peak and Average Operating Power
Various P1dB Compression Powers
Low Flat Leakage Power
Proven Reliable, Silicon Nitride Passivation
RoHS Compliant
V13
Chip Outline
A Square
Description
M/A-COM Technology Solutions produces a series of
silicon PIN limiter diodes with small and medium I-region
lengths which are specifically designed for high signal
applications. The devices are designed to provide low
insertion loss, at zero bias, as well as low flat leakage
power with fast signal response/recovery times. Parts are
available as discrete die or assembled into a variety of
surface mount or ceramic pill packages. See the
Available
Case Style
table on page 6 for the specific ceramic
package styles and their availability for individual part
numbers
.
Anode
B
Applications
The MA4Lseries of PIN limiter diodes are designed for use
in passive limiter control circuits to protect sensitive
receiver components such as low noise amplifiers (LNA),
detectors, and mixers covering the 10 MHz to 18 GHz
frequency range.
Full Area Cathode
Absolute Maximum Ratings T
AMB
= 25°C
(Unless otherwise specified)
Parameter
Forward Current
Operating Temperature
Storage Temperature
Junction Temperature
Mounting Temperature
Absolute Maximum
100mA
-55°C to +125°C
-55°C to +150°C
+175°C
+320°C for 10 sec.
1
ODS
134
Dimension
A
B
mils
15 ± 2
7 ±1*
µm
381 ± 51
178 ± 25.4
Note:
The MADL-000301-01340W and MA4L401-134
“B” dimension, is 10 ±1 mils
RF Peak & C.W. Incident Power Per Performance Table
Note:
1. Exceeding any of the above ratings may cause
permanent damage.
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4L
Series
Silicon PIN Limiter Diodes
Un-Packaged Die Electrical Specifications at T
AMB
= 25°C
Nominal Characteristics
Part Number
Carrier
Minimum Maximum Minimum Maximum Maximum
I-Region Contact
Thermal
Lifetime Thickness Diameter Resistance
Reverse Reverse
C
j0V
C
j0V
R
S 10mA
I
FOR
=10mA
Voltage Voltage
I
REV
= -6mA
µM
mils
°C/W
1
nS
1
Ohms
1
pF
pF
V
R
V
R
15
20
20
30
30
50
100
200
250
35
35
35
50
50
75
0.08
0.10
0.09
0.14
0.13
0.07
0.18
0.20
0.19
0.21
0.20
0.15
0.15
0.20
0.30
2.10
2.10
2.00
2.00
2.50
2.50
2.00
1.50
1.20
10
10
10
20
15
70
90
200
800
2
2
2
3
3
4
13
20
25
1.2
1.2
1.2
1.4
1.5
1.5
3.5
3.0
4.5
175
175
175
150
150
150
30
30
25
V13
MA4L011-134
MA4L021-134
MA4L022-134
MA4L031-134
MA4L032-134
MA4L062-134
MA4L101-134
MADL-000301-01340W
MA4L401-134
Note:
1.
Test performed with the chip mounted in an ODS-30 package.
*
Nominal High Signal Performance at T
AMB
= 25°C
Incident Peak
Power for
10dB Limiting
@
9.4GHz
dBm
30
31
31
33
34
38
45
46
52
Incident Peak
Power for
Recovery Time
15dB Limiting
(3 dB)
Maximum
Incident
@
@
Maximum CW
9.4GHz
50W Peak Power Peak Power Input Power
dBm
40
41
41
43
44
50
53
59
60
nS
10
15
15
25
25
75
100
50
250
Watts
80
90
90
125
125
200
250
500
1000
Watts
2
3
3
4
4
5
6
7
10
Part Number
Incident Peak
Power for
1dB Limiting
@
9.4GHz
dBm
MA4L011-134
MA4L021-134
MA4L022-134
MA4L031-134
MA4L032-134
MA4L062-134
MA4L101-134
MADL-000301-01340W
MA4L401-134
2
7
8
8
10
11
15
20
23
30
*
See page 3 for high signal performance parameter notes.
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4L
Series
Silicon PIN Limiter Diodes
Typical High Signal Peak Power Performance for the Single Shunt Limiter Diode
in a 50
Ω
Test Fixture
Typical Peak Power Performance for Single Shunt Limiter Diode in 50 Ohm System
at 9.4 GHz, 1uS Pulse Width, 0.001 Duty
45
V13
40
35
MA4L011-134, MA4L021-134,
MA4L022-134
MA4L031-134, MA4L032-134
MA4L101-134
30
MA4L401-132
MA4L301-134
Pout ( dBm )
25
20
15
10
0 dB Loss
Line
10 dB Loss
Line
20 dB Loss
Line
30 dB Loss
Line
5
0
0
10
20
Pin ( dBm )
30
40
50
High Signal Performance:
Measured using a single shunt diode (die) attached directly to the gold plated RF
housing ground with 2 mil thick conductive silver epoxy in a 50Ω, SMA, connectorized test fixture. Chip anode
contact is thermo-compression wire bonded using a 1 mil. dia. gold wire onto a 7.2 mil thick Rogers 5880 Duroid
microstrip trace. A shunt coil provides the D.C. return. Test frequency = 9.4 GHz, For peak power
measurements RF pulse width = 1.0 µS, 0.001% duty cycle.
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4L
Series
Silicon PIN Limiter Diodes
Application Circuits
Typical +60dBm Peak Power, 1µS P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit
V13
Transmission Line: 90º @ Fo
Transmission Line: 90º @ Fo
RF Input
RF Output
MA4L401-134
Coil: D.C. Return
MA4L101-134
MA4L032-134
Typical +50dBm Peak Power, 1µS P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit
Transmission Line: 90º @ Fo
RF Input
RF Output
MA4L032-134
Coil: D.C. Return
MA4L022-134
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4L
Series
Silicon PIN Limiter Diodes
Notes for Specification and Nominal High Signal Performance Tables:
1)
Maximum Series Resistance:
R
S
, is measured at 500 MHz in the ODS-30 package and is equivalent to the
total diode resistance: R
S
= Rj (Junction Resistance) + R
O
(Ohmic Resistance)
2)
Nominal C.W. Thermal Resistance:
Ө
TH
is measured in a ceramic pill package, ODS-30, mounted to a
metal (infinite) heatsink. Chip only thermal resistance values are approximately 2°C/W lower than the
ODS-30 listed package values in the specifications table.
3)
Maximum High Signal Performance:
Measured using a single shunt diode (die) attached directly to the gold
plated RF housing ground with 2 mil thick conductive silver epoxy in a 50Ω, SMA, connectorized test fixture.
Chip anode contact is thermo-compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick
Rogers 5880 Duroid microstrip trace. A shunt coil provides the D.C. return. Test frequency = 9.4 GHz,
RF pulse width = 1.0 µS, Duty Cycle = 0.001%.
4)
Maximum C.W. Incident Power:
Measured in a 50Ω, SMA, connectorized housing @ 4GHz utilizing a TWT
amplifier and the same single diode assembly configuration as stated in Note 3 above.
V13
Die Handling and Mounting Information
Handling:
All semiconductor chips should be handled with care in order to avoid damage or contamination
from perspiration, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up
tools is strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized.
Die Attach:
The die have Ti-Pt-Au back and anode metal, with a final gold thickness of 1.0µM. Die can be
mounted with a gold-tin, eutectic solder perform or conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness or < ± 0.002”.
•
Eutectic Die Attachment Using Hot Gas Die Bonder:
An 80/20, gold / tin eutectic solder perform is
recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot
gas is applied, the temperature at the tool tip should be approximately 290°C. The chip should not be
exposed to a temperatures in excess of 320°C for more than 10 seconds.
•
Eutectic Die Attachment Using Reflow Oven:
Refer to
Application Note M538,
“Surface Mounting
Instructions”.
•
Epoxy Die Attachment:
A thin, controlled amount of electrically conductive silver epoxy should be applied,
approximately 1-2 mils thick to minimize ohmic and thermal resistances. A small epoxy fillet should be visible
around the outer perimeter of the chip after placement to ensure full area coverage. Cure the conductive
silver epoxy per the manufacturer’s schedule, typically 150˚C for 1 hour.
Wire Bonding:
The chip’s anode metallization stack is comprised of Ti/Pt/Au with a final gold thickness of
1.0µM. Thermo-compression wedge bonding using a .7 to 1 mil diameter gold wire is recommended, depending
on the contact diameter. The heat stage temperature should be set to approximately 200°C with a bonding tip
temperature of 125˚C and a force of 18 to 40 grams. Use of ultrasonic energy is not advised but if necessary it
should be adjusted to the minimum required to achieve a good bond. Excessive energy or force applied to the top
contact will cause the metallization to dislodge and lift off. Automatic ball bonding may also be used.
S
ee
Application Note M541,
“Bonding and Handling Procedures for Chip Diode Devices” for more detailed handling and
assembly information.
5
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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