MA4FCP300
Silicon Flip Chip
PIN Diode
Features
•
•
•
•
•
•
Lower Series Resistance : 2.6
Ω
Lower Capacitance : 40 fF
Faster Switching Speed : 40 nS
Silicon Nitride Reliability Passivation
Polyimide Scratch Protection
Designed for Automated Pick and Place Insertion
•
Rugged by Design
Top View
Rev. V1
1269 Outline
A
B
F
Description
M/A-COM’s MA4FCP Series consists of Silicon Flip
Chip PIN diodes fabricated with M/A-COM’s patented
HMIC process. This diode is fabricated on epitaxial
wafers using a process designed for repeatable electrical
characteristics and extremely low parasitics. This diode
is fully passivated with Silicon Nitride and has an
additional layer of Polyimide for scratch protection.
These protective coatings prevent damage to the junction
during automated or manual handling. This flip chip
configuration is suitable for pick and place insertion.
Side View
D
E
D
C
Bottom View
Applications
The small 0315 outline and low 0.12 pS RC product,
make the device useful for multi-throw switch and
switched phase shifter circuits requiring < 40 nS
switching speeds up to 18 GHz operating frequency.
Cathode Mark
Dim
.
A
B
C
D
E
F
inches
min.
0.0269
0.0135
0.0040
0.0041
0.0124
0.0069
max.
0.0289
0.0155
0.0080
0.0061
0.0144
0.0089
(mm)
min.
0.683
0.343
0.102
0.105
0.315
0.175
max.
0.733
0.393
0.203
0.155
0.365
0.225
Absolute Maximum Ratings @ 25 ˚C
1
Parameter
Absolute Maximum
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power
Mounting Temperature
1.
1
100 mA
- 100 V
- 55
°C
to + 125
°C
- 55
°C
to + 150
°C
+ 175
°C
150 mW
+ 300
°C
for 10 seconds
Exceeding these limits may cause permanent damage.
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4FCP300
Silicon Flip Chip
PIN Diode
Electrical Specifications @ TA = +25°C
Parameters @ Conditions
Total Capacitance @ -10V, 1MHz
1
Total Capacitance @ -10V, 1GHz
1,3
Series Resistance @ +50mA
2,3
, 100MHz
Series Resistance @ +50mA
2,3
, 1GHz
Forward Voltage @ +100mA
Reverse Voltage @ -10μA
Reverse Current @ -40V
50 – 90 % Lifetime @ + 10mA / - 6mA
Steady State Thermal Resistance
4
1.
2.
3.
4.
Symbol
C
T
C
T
R
S
R
S
V
F
V
R
I
R
TL
θ
Units
pF
pF
Ω
Ω
V
V
μA
ns
° C/W
Min.
Typ.
0.04
0.025
2.1
2.6
1.1
| -100 |
140
450
Max.
0.08
2.8
1.5
| - 10 |
Rev. V1
| -70 |
Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance, Cp.
Series resistance R
S
is equivalent to the total diode series resistance including the junction resistance Rj.
Rs and Cp measured on an HP4291A with die mounted in an ODS-186 package.
Steady-State Thermal Resistance measured with die mounted in an ODS-186 package.
—————————————————————————————————————————————————————————
Assembly Procedures
The following precautions should be observed to avoid
damaging these devices.
Mounting Techniques
These devices were designed for insertion onto hard or
soft substrates with the junction side down. They can be
mounted with electrically conductive epoxy or with a
low temperature solder preform. The die can also be
assembled with the junction side up, and wire or ribbon
bonds made to the pads.
Cleanliness
These devices should be handled in a clean environment. Do
not attempt to clean die after installation.
ESD
These devices very susceptible to ESD and are rated Class 0
(0-199V) per HBM MIL-STD-883, method 3015.7 [C =
100pF
±10%,
R = 1.5kΩ
±1%].
Even though tested die pass
100V ESD, they must be handled in a static-free
environment.
Solder Die Attach using Electrically
Conductive Ag Epoxy and Solder
These chips are designed to be inserted onto hard or soft
substrates with the junction side down. They should be
mounted onto silkscreened circuits using Electrically
Conductive Ag Epoxy, approximately 1-2 mils in
thickness and cured at approximately 90°C to 150
°C
per
manufacturer’s schedule. For extended cure times > 30
minutes, temperatures must be below 200
°C.
Sn Rich Solders ( > 30 % by Weight ) are not
recommended due to the Tungsten Metallization scheme
beneath the gold contacts. Indalloy or 80 Au/20 Sn
Solders are acceptable. Maximum soldering temperature
must be < 300
°C
for < 10 seconds.
General Handling
The protective polymer coating on the active areas of these
devices provides scratch protection, particularly for the metal
airbridge that contacts the anode. Die can be handled with
tweezers or vacuum pickups and are suitable for use with
automatic pick-and-place equipment.
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4FCP300
Silicon Flip Chip
PIN Diode
Circuit Mounting Dimensions ( Inches )
Rev. V1
0.013
0.012
(2) PL
0.008
(2) PL
Ordering Information
Part Number
MA4FCP300
MA4FCP300-T
MA4FCP300-W
Packaging
Die in Carrier
Tape/Reel
Wafer on Frame
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4FCP300
Silicon Flip Chip
PIN Diode
Capacitance vs Frequency
0.08
0.07
0.06
0.05
Ct (F)
0.04
Rev. V1
Ct @ -10V
0.03
0.02
0.01
0.00
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
Frequency (GHz)
Rs vs Frequency
5.00
4.50
4.00
3.50
Rs ( Ohms )
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0.10
4
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
Rs @ 50 mA
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
Frequency (GHz)
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
MA4FCP300
Silicon Flip Chip
PIN Diode
Diode Model
Rs
Rev. V1
_
Ls = 0.6 nH
+
Ct
MA4FCP300 SPICE Model
PinDiodeModel
NLPINM1
Is=1.0E-14 A
wBv= 100 V
Vi=0.0 V
wPmax= 125 mW
Un= 900 cm^2/V-sec
Ffe= 1.0
Wi= 7.5 um
AllParams=
Rr= 20 K Ohms
Cjmin= 0.04 pF
Tau= 0.14 usec
Rs(I)= Rc + Rj(I) = 0.05 Ohm + Rj(I)
Cj0= 0.07 pF
Vj= 0.7 V
M= 0.5
Fc= 0.5
Imax= 1.0 E+5 A/m^2
Kf=0.0
Af=1.0
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
5
•
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
•
India
Tel: +91.80.43537383
•
China
Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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