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MA4E2501

产品描述KEYSTONE - 1290 - BATTERY HOLDER; 9V; SNAP IN; ALUM; SOLDER LUG
产品类别未分类   
文件大小51KB,共3页
制造商MACOM
官网地址http://www.macom.com
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MA4E2501概述

KEYSTONE - 1290 - BATTERY HOLDER; 9V; SNAP IN; ALUM; SOLDER LUG

KEYSTONE - 1290 - 电池 HOLDER; 9V; SNAP IN; ALUM; 焊接 LUG

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MA4E2501-1290 Series
SURMOUNT
TM
Low Barrier
0201 Footprint Silicon Schottky Diodes
Rev. V1
Features
Extremely Low Parasitic Capitance and Inductance
Extremely Small 0201 (600x300um) Footprint
Surface Mountable in Microwave Circuits , No Wirebonds
Required
Rugged HMIC Construction with Polyimide Scratch Protection
Reliable, Multilayer Metalization with a Diffusion
Barrier, 100% Stabilization Bake (300°C, 16 hours)
Lower Susceptibility to ESD Damage
A
B
Description
The MA4E2501L-1290 SurMount™ Diodes are Silicon Low
Barrier Schottky Devices fabricated with the patented
Heterolithic Microwave Integrated Circuit (HMIC) process.
HMIC circuits consist of Silicon pedestals which form diodes or
via conductors embedded in a glass dielectric, which acts as the
low dispersion, microstrip transmission medium. The
combination of silicon and glass allows HMIC devices to have
excellent loss and power dissipation characteristics in a low
profile, reliable device.
The Surmount Schottky devices are excellent choices for circuits
requiring the small parasitics of a beam lead device coupled with
the superior mechanical performance of a chip. The SurMount
structure employs very low resistance silicon vias to connect the
Schottky contacts to the metalized mounting pads on the bottom
surface of the chip. These devices are reliable, repeatable, and a
lower cost performance solution to conventional devices. They
have lower susceptibility to electrostatic discharge than
conventional beam lead Schottky diodes.
The multi-layer metalization employed in the fabrication of the
Surmount Schottky junctions includes a platinum diffusion
barrier, which permits all devices to be subjected to a 16-hour
non-operating stabilization bake at 300°C.
The extremely small “ 0201 ” outline allows for Surface Mount
placement and multi-functional polarity orientations.
C
D
E
F
G
-
Cathode
+
Anode
Case Style 1290
dim.
A
B
C
D
E
F
G
min.
0.023
0.011
0.004
0.006
0.007
0.006
0.009
in
max.
0.025
0.013
0.008
0.008
0.009
0.008
0.011
mm
min. max.
0.575 0.625
0.275 0.325
0.102 0.203
0.150 0.200
0.175 0.225
0.150 0.200
0.220 0.270
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions is considering for development. Performance is based on target specifications,
simulated results, and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications
are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be
available. Commitment to produce in volume is not guaranteed.
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
India
Tel: +91.80.43537383
China
Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.

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