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RSMT2AP-39004J-T3

产品描述Fixed Resistor, Thin Film, 0.25W, 39000000ohm, 100V, 5% +/-Tol, 150ppm/Cel, Surface Mount, 1206, CHIP, LEAD FREE
产品类别无源元件    电阻器   
文件大小29KB,共1页
制造商Mini-Systems Inc (MSI)
官网地址http://www.mini-systemsinc.com
标准  
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RSMT2AP-39004J-T3概述

Fixed Resistor, Thin Film, 0.25W, 39000000ohm, 100V, 5% +/-Tol, 150ppm/Cel, Surface Mount, 1206, CHIP, LEAD FREE

RSMT2AP-39004J-T3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-609代码e4
制造商序列号RSMT
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR
额定功率耗散 (P)0.25 W
额定温度70 °C
电阻39000000 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术THIN FILM
温度系数150 ppm/°C
端子面层Silver/Palladium (Ag/Pd)
端子形状ONE SURFACE
容差5%
工作电压100 V
Base Number Matches1

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THIN FILM SURFACE MOUNT RESISTORS
MINI-SMT
MINI-SMT
TM
RSMT SERIES RESISTORS
DAT
MECHANICAL DATA
H
1Ω
100MΩ.
MINI-SMT
TM
thin film resistors offer maximum benefits in ohmic value ranges from 1
through 100M
Ω.
T.C.R.'s to
±5ppm/°C - and absolute tolerances to 0.05%. Available in 0505, 0805, 1206 and 0603 sizes, these resistors
provide proven thin film performance in a surface mount solderable style.
W
SIZE: 0505
0805
1206
0603
SUBSTRATE
SUBSTRATE
RESISTOR
MATERIAL
BONDING MATERIAL
PAD
BOND PAD SIZE
0505
0805
1206
0603
0.050" x 0.050" (±0.003") x 0.050" NOM.
0.080" x 0.050" (±0.003") x 0.050" NOM.
0.120" x 0.060" (±0.003") x 0.050" NOM.
0.060" x 0.030" (±0.003") x 0.050" NOM.
ALUMINA
PROPRIETARY
PROPRIETARY
PALLADIUM SILVER OR SOLDER, GOLD OPTIONAL
0.015" x 0.050" ±0.005"
0.015" x 0.050" ±0.005"
0.020" x 0.060" ±0.005"
0.010" x 0.030" ±0.005"
1
TO 100M
100MΩ
0.1%, 0.5%, 1%, 2%, 5%, 10%: TO 0.05% AVAILABLE
STANDARD:
±150ppm/°C STANDARD: OPTIONAL TO ±5ppm/°C
STANDARD:
±300ppm/°C STANDARD: OPTIONAL TO ±100ppm/°C
DAT
ELECTRICAL DATA
L
BOTTOM VIEW
RESISTANCE
RESISTANCE RANGE
TOLERANCES
T.C.R.
50MΩ
1
TO 50M
50MΩ
100MΩ
50M
TO 100M
DAT
SERIES DATA
CURRENT NOISE
DIELECTRIC BREAKDOWN
INSULATION RESISTANCE
INSULATION RESISTANCE
OPERATING VOLT
OPERATING VOLTAGE
RATING
POWER RATING
SHORT TERM OVERLOAD
HIGH TEMP EXPOSURE
THERMAL SHOCK
RESISTANCE
MOISTURE RESISTANCE
STABILITY
STABILITY
OPERATING
OPERATING TEMP RANGE
101Ω
250KΩ
101
TO 250K
: -40dB
100Ω
250KΩ
100
,
250K
: -30dB
400 V MIN.
10
12
MIN.
100 V MAX.
DERATED LINEARLY
250 mW (70°C DERATED LINEARLY TO 150°C) P = E ²/R
RATED
25°
±0.
0.2
5X RATED POWER, 25°C, 5 SEC., ±0.25% MAX.
R/R: ±0.1% MSI TYPICAL
0.03
03%
±0.25%
150°C, 100 HRS., ±0.25% MAX.
R/R: ±0.03% MSI TYPICAL
107F, ±0.25%
MIL-STD 202, METHOD 107F, ±0.25% MAX.
R/R: ±0.1% MSI TYPICAL
±0.
0.5
0.1
MIL-STD 202, METHOD 106, ±0.5% MAX.
R/R: ±0.1% MSI TYPICAL
70°C, 125mW, ±0.5%
1000 HRS., 70°C, 125mW, ±0.5% MAX.
R/R: ±0.1% MSI TYPICAL
-55
-55°C TO +150°C
DESIGNATION
PART NUMBER DESIGNATION
RSMT X
SERIES
1:(0505)
2:(1206)
3:(0805)
4:(0603)
A
SUBSTRATE
SUBSTRATE
A = Alumina
P
RESISTIVE
FILM
P = Proprietary
XXXXX
OHMIC VALUE
5-Digit
Number: 1st
4 Digits Are
Significant
With "R" As
Decimal
Point When
Required.
5th Digit
Represents
Number of
Zeros.
X
TOLERANCE
Q = 0.05%**
B = 0.1%**
D = 0.5%
F = 1%
G = 2%
J = 5%
K = 10%
X
OPTION
DESIGNATOR
DESIGNATOR
(If Required)
A = ±50ppm/°C
B = ±25ppm/°C**
C = ±10ppm/°C**
D = ±5ppm/°C**
F = ±100ppm/°C
T = Solder
Terminations
T3 = Leadfree Solder
Terminations
U = Untinned
TR = Tape & Reel*
PS = Pd Silver Bond
Pads
G = Gold Bond Pads
PACKAGED
PACKAGED
PACKAGED
PACKAGED
PACKAGED
RESISTORS
5MΩ
Tol.,
EXAMPLES: RSMT 1 AP-50003B-CT = 0505, 5M
, ±0.1% Tol., 10ppm/°C with
Termination.
Solder Termination.
CONSULT
AV
* CONSULT SALES FOR AVAILABILITY
** VALUE DEPENDENT
MINI-SYSTEMS, INC.
THIN FILM DIVISION
DAVID
ATTLEBORO,
20 DAVID ROAD, N. ATTLEBORO, MA 02760
508-695-0203 FAX: 508-695-6076
DCN TF 134-C-0306
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