OT PLD, 6ns, BICMOS, PQCC28, PLASTIC, LCC-28
| 参数名称 | 属性值 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | S-PQCC-J28 |
| 长度 | 11.5316 mm |
| 专用输入次数 | 12 |
| I/O 线路数量 | |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 12 DEDICATED INPUTS, 0 I/O |
| 输出函数 | LATCHED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 6 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.5316 mm |
| Base Number Matches | 1 |
| CY7C338-6JCT | CY7C338-6DC | CY7C338-6PC | CY7C338-6JCR | CY7C338-6JC | |
|---|---|---|---|---|---|
| 描述 | OT PLD, 6ns, BICMOS, PQCC28, PLASTIC, LCC-28 | OT PLD, 6ns, PAD-Type, BICMOS, CDIP28, 0.300 INCH, CERDIP-28 | OT PLD, 6ns, PAD-Type, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | OT PLD, 6ns, BICMOS, PQCC28, PLASTIC, LCC-28 | OT PLD, 6ns, PAD-Type, BICMOS, PQCC28, PLASTIC, LCC-28 |
| 零件包装代码 | QLCC | DIP | DIP | QLCC | QLCC |
| 包装说明 | QCCJ, | 0.300 INCH, CERDIP-28 | 0.300 INCH, PLASTIC, DIP-28 | QCCJ, | PLASTIC, LCC-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | not_compliant | not_compliant | unknown | not_compliant |
| JESD-30 代码 | S-PQCC-J28 | R-GDIP-T28 | R-PDIP-T28 | S-PQCC-J28 | S-PQCC-J28 |
| 长度 | 11.5316 mm | 37.0205 mm | 35.941 mm | 11.5316 mm | 11.5316 mm |
| 专用输入次数 | 12 | 12 | 12 | 12 | 12 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 12 DEDICATED INPUTS, 0 I/O | 12 DEDICATED INPUTS, 0 I/O | 12 DEDICATED INPUTS, 0 I/O | 12 DEDICATED INPUTS, 0 I/O | 12 DEDICATED INPUTS, 0 I/O |
| 输出函数 | LATCHED | LATCHED | LATCHED | LATCHED | LATCHED |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | DIP | QCCJ | QCCJ |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 5.08 mm | 5.08 mm | 4.57 mm | 4.57 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | QUAD |
| 宽度 | 11.5316 mm | 7.62 mm | 7.62 mm | 11.5316 mm | 11.5316 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 |
| 架构 | - | PAD-TYPE | PAD-TYPE | - | PAD-TYPE |
| JESD-609代码 | - | e0 | e0 | - | e0 |
| 输入次数 | - | 12 | 12 | - | 12 |
| 输出次数 | - | 8 | 8 | - | 8 |
| 产品条款数 | - | 16 | 16 | - | 16 |
| 封装等效代码 | - | DIP28,.3 | DIP28,.3 | - | LDCC28,.5SQ |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 电源 | - | 5 V | 5 V | - | 5 V |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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