Line Driver, 4 Func, 4 Driver, BIPolar, 0.067 X 0.084 INCH, DIE-16
参数名称 | 属性值 |
零件包装代码 | DIE |
包装说明 | DIE, |
针数 | 16 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
差分输出 | YES |
驱动器位数 | 4 |
输入特性 | STANDARD |
接口集成电路类型 | LINE DRIVER |
接口标准 | EIA-422; FED STD 1020 |
JESD-30 代码 | R-XUUC-N16 |
功能数量 | 4 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | COMPLEMENTARY |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装形状 | RECTANGULAR |
封装形式 | UNCASED CHIP |
认证状态 | Not Qualified |
最大压摆率 | 80 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子位置 | UPPER |
最大传输延迟 | 20 ns |
Base Number Matches | 1 |
AM26LS31XM | AM26LS31DM | AM26LS31DM883B | AM26LS31FM | AM26LS31XC | |
---|---|---|---|---|---|
描述 | Line Driver, 4 Func, 4 Driver, BIPolar, 0.067 X 0.084 INCH, DIE-16 | Line Driver, 4 Func, 4 Driver, BIPolar, CDIP16, HERMETIC SEALED, DIP-16 | Line Driver, 4 Func, 4 Driver, BIPolar, CDIP16, HERMETIC SEALED, DIP-16 | Line Driver, 4 Func, 4 Driver, BIPolar, CDFP16, CERPACK-16 | Line Driver, 4 Func, 4 Driver, BIPolar, 0.067 X 0.084 INCH, DIE-16 |
零件包装代码 | DIE | DIP | DIP | DFP | DIE |
包装说明 | DIE, | DIP, DIP16,.3 | DIP, | DFP, FL16,.3 | DIE, |
针数 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknow | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
差分输出 | YES | YES | YES | YES | YES |
驱动器位数 | 4 | 4 | 4 | 4 | 4 |
输入特性 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER |
接口标准 | EIA-422; FED STD 1020 | EIA-422; FED STD 1020 | EIA-422; FED STD 1020 | EIA-422; FED STD 1020 | EIA-422; FED STD 1020 |
JESD-30 代码 | R-XUUC-N16 | R-CDIP-T16 | R-CDIP-T16 | R-CDFP-F16 | R-XUUC-N16 |
功能数量 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - |
封装主体材料 | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
封装代码 | DIE | DIP | DIP | DFP | DIE |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | UNCASED CHIP | IN-LINE | IN-LINE | FLATPACK | UNCASED CHIP |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
端子位置 | UPPER | DUAL | DUAL | DUAL | UPPER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY |
最大传输延迟 | 20 ns | 30 ns | - | 30 ns | 20 ns |
长度 | - | 19.431 mm | 19.431 mm | 10.0965 mm | - |
筛选级别 | - | MIL-STD-883 Class C | MIL-STD-883 Class B | MIL-STD-883 Class C | - |
座面最大高度 | - | 5.08 mm | 5.08 mm | 2.159 mm | - |
端子节距 | - | 2.54 mm | 2.54 mm | 1.27 mm | - |
宽度 | - | 7.62 mm | 7.62 mm | 6.731 mm | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved