OT PLD, 15ns, PAL-Type, TTL, PQCC20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | QCCJ, LDCC20,.4SQ |
Reach Compliance Code | unknown |
架构 | PAL-TYPE |
JESD-30 代码 | S-PQCC-J20 |
JESD-609代码 | e0 |
输入次数 | 18 |
输出次数 | 8 |
产品条款数 | 72 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出函数 | COMBINATORIAL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC20,.4SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 5 V |
可编程逻辑类型 | OT PLD |
传播延迟 | 15 ns |
认证状态 | Not Qualified |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
PLHS18P8BA | PLHS18P8A/BSA | PLHS18P8A/BRA | PLHS18P8A/B2A | PLHS18P8BN | PLHS18P8AN-B | PLHS18P8AN | PLHS18P8AA | |
---|---|---|---|---|---|---|---|---|
描述 | OT PLD, 15ns, PAL-Type, TTL, PQCC20 | OT PLD, 30ns, PAL-Type, TTL, CDFP20, | OT PLD, 30ns, PAL-Type, TTL, CDIP20, | OT PLD, 30ns, PAL-Type, TTL, CQCC20, | OT PLD, 15ns, PAL-Type, TTL, PDIP20 | OT PLD, 20ns, PAL-Type, TTL, PDIP20 | OT PLD, 20ns, PAL-Type, TTL, PDIP20 | OT PLD, 20ns, PAL-Type, TTL, PQCC20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
JESD-30 代码 | S-PQCC-J20 | R-XDFP-F20 | R-XDIP-T20 | S-XQCC-N20 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | S-PQCC-J20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
输入次数 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
输出次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
产品条款数 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出函数 | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | DFP | DIP | QCCN | DIP | DIP | DIP | QCCJ |
封装等效代码 | LDCC20,.4SQ | FL20,.3 | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | LDCC20,.4SQ |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
传播延迟 | 15 ns | 30 ns | 30 ns | 30 ns | 15 ns | 20 ns | 20 ns | 20 ns |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | NO | NO | NO | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | FLAT | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | QCCJ, LDCC20,.4SQ | DFP, FL20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | - | QCCJ, LDCC20,.4SQ |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
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