External reference Clock input or Crystal connection.
Crystal connection. If using an external reference, this pin must be left
unconnected.
Modulation enable pin/ Power down pin. Has an Internal pull up resistor.
Modulation rate setting pin
Centre spread, SEL = “L”: Frequency Deviation ±0.5%
Centre spread, SEL = “H”: Frequency Deviation ±1.0%
Has an Internal pull up resistor.
Non-modulated clock output pin. The Frequency is same as input frequency. This
pin becomes to “L” at power-down.
Ground Connection. Connect to system ground.
Modulated clock output pin
This pin becomes to“L” at power-down.
Power Supply Voltage Pin. Connect to +3.3V.
5
6
7
8
REFOUT
VSS
ModOUT
VDD
O
P
O
P
Note: 1. SSON Pin is available in ASM3P2187A Device and PDB Pin is available in ASM3P2187B Device.
Rev. 1 | Page 2 of 9 | www.onsemi.com
ASM3P2187A/B
Modulation Enable Setting Table
SSON
L
H
Modulation
No Modulation
Modulation
Power down Status Table
PDB
L
H
Status
Power Down Status
Operating Status
Spread Range Selection Table
SEL
L
Deviation @ 15MHz
±0.50%
H
±1.00%
Absolute Maximum Ratings
Symbol
VDD
V
IN
V
OUT
T
STG
T
s
T
J
T
DV
Parameter
Rating
-0.5 to +4.6
VSS-0.5 to VDD+0.5
VSS-0.5 to VDD+0.5
-55 to +125
260
150
2
Unit
V
V
V
°C
°C
°C
KV
Supply Voltage pin with respect to Ground
Input Voltage pin with respect to Ground
Output Voltage pin with respect to Ground
Storage temperature
Max. Soldering Temperature (10 sec)
Junction Temperature
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Rev. 1 | Page 3 of 9 | www.onsemi.com
ASM3P2187A/B
DC Electrical Characteristics
Symbol
V
IL
V
IH
I
IL
I
IH
V
OL
V
OH
I
CC
I
DD
VDD
t
ON
Z
OUT
C
IN
C
L
Input low voltage
Input high voltage
Input low current
Input high current
Output low voltage
Output high voltage
For ModOUT, I
OL
= 4mA
For REFOUT, I
OL
= 3mA
For ModOUT, I
OH
= -4mA
For REFOUT, I
OH
= -3mA
VSS
2.4
Parameter
Min
VSS-0.3
2.0
Typ
Max
0.8
VDD+0.3
-50
+50
0.4
VDD
17
8
Unit
V
V
µA
µA
V
V
mA
mA
V
mS
Ω
Dynamic supply current (Unloaded Outputs)
Static supply current standby mode
(CLKIN / XIN pulled LOW)
Operating voltage
Power up time (first locked clock cycle after power up)
Clock output impedance
Input Capacitance
Load Capacitance
3.3
3.3
2
50
3.6
5
7
15
pF
pF
AC Electrical Characteristics
Symbol
CLKIN / XIN
CLKOUT
M
F
t
LH
t
HL
1
1
Parameter
REFOUT
ModOUT
Min
12.5
12.5
50
32.4
Typ
15
15
60
39
2
1.5
±250
±150
Max
20
20
80
52
2.5
2
±325
±200
55
Unit
MHz
MHz
KHz
nS
nS
pS
%
Input Clock frequency
Output Clock
frequency
Modulation Frequency
Output rise time ( Measured from 20% to 80% )
Output fall time ( Measured from 80% to 20% )
Cycle-to-Cycle Jitter
Period Jitter (REFOUT)
Output duty cycle
t
JC
t
Jp
t
D
45
50
Note: 1. t
LH
and t
HL
are measured with a capacitive load of 15pF.
Rev. 1 | Page 4 of 9 | www.onsemi.com
ASM3P2187A/B
Output Clock Duty Cycle t
D =
(t
b
/ t
a
)
t
a
t
b
VDD/2
ModOUT,
REFOUT
Cycle-to-Cycle Jitter (t
JC
= [t
n
-t
n
+ 1])
ModOUT
t
n
t
n+1
Note: Cycle-cycle jitter indicates the difference between a certain cycle and the immediately
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