Parallel IO Port, 8-Bit, ECL, CDIP24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP24,.3 |
Reach Compliance Code | compliant |
JESD-30 代码 | R-XDIP-T24 |
JESD-609代码 | e0 |
位数 | 8 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class B (Modified) |
表面贴装 | NO |
技术 | ECL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
AM2953A/DMC | AM2952APC | AM2952A/BLA | AM2952AJC | AM2953APC | AM2952DCTB | AM2952DCT | |
---|---|---|---|---|---|---|---|
描述 | Parallel IO Port, 8-Bit, ECL, CDIP24 | Parallel IO Port, 8-Bit, ECL, PDIP24, | Parallel IO Port, 8-Bit, ECL, CDIP24, | Parallel IO Port, 8-Bit, ECL, PQCC28 | Parallel IO Port, 8-Bit, ECL, PDIP24 | Parallel IO Port, 8-Bit, ECL, CDIP24 | Parallel IO Port, 8-Bit, ECL, CDIP24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCJ, LDCC28(UNSPEC) | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
Reach Compliance Code | compliant | unknow | unknown | unknown | unknown | compliant | compliant |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 24 | 24 | 24 | 28 | 24 | 24 | 24 |
最高工作温度 | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | - | -55 °C | - | - | -55 °C | -55 °C |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | QCCJ | DIP | DIP | DIP |
封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | LDCC28(UNSPEC) | DIP24,.3 | DIP24,.3 | DIP24,.3 |
封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
表面贴装 | NO | NO | NO | YES | NO | NO | NO |
技术 | ECL | ECL | ECL | ECL | ECL | ECL | ECL |
温度等级 | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
JESD-30 代码 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | - | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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