IC IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,8PIN,CERAMIC, Operational Amplifier
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | DIP |
针数 | 8 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
频率补偿 | YES |
最大输入失调电压 | 2000 µV |
JESD-30 代码 | R-XDIP-T8 |
JESD-609代码 | e0 |
低-偏置 | YES |
低-失调 | NO |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5/+-15 V |
认证状态 | Not Qualified |
标称压摆率 | 5 V/us |
最大压摆率 | 0.4 mA |
供电电压上限 | 36 V |
表面贴装 | NO |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
最小电压增益 | 500000 |
Base Number Matches | 1 |
AD821SQ | AD821AQ | AD821BQ | AD821JN | AD821JR | AD821KN | |
---|---|---|---|---|---|---|
描述 | IC IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,8PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,8PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,8PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,SINGLE,BIPOLAR/JFET,DIP,8PIN,PLASTIC, Operational Amplifier | IC OP-AMP, Operational Amplifier | IC IC,OP-AMP,SINGLE,BIPOLAR/JFET,SOP,8PIN,PLASTIC, Operational Amplifier |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
频率补偿 | YES | YES | YES | YES | YES | YES |
最大输入失调电压 | 2000 µV | 1600 µV | 400 µV | 1500 µV | 1500 µV | 400 µV |
JESD-30 代码 | R-XDIP-T8 | R-XDIP-T8 | R-CDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
低-偏置 | YES | YES | YES | YES | YES | YES |
低-失调 | NO | NO | YES | NO | NO | YES |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | SOP | DIP |
封装等效代码 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | 5/+-15 V | 5/+-15 V | +-15 V | 5/+-15 V | 5/+-15 V | +-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称压摆率 | 5 V/us | 5 V/us | 3 V/us | 5 V/us | 5 V/us | 3 V/us |
供电电压上限 | 36 V | 36 V | 36 V | 36 V | 36 V | 36 V |
表面贴装 | NO | NO | NO | NO | YES | NO |
温度等级 | MILITARY | OTHER | OTHER | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
最小电压增益 | 500000 | 500000 | 500000 | 500000 | 500000 | 500000 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
零件包装代码 | DIP | DIP | DIP | DIP | - | SOIC |
针数 | 8 | 8 | 8 | 8 | - | 8 |
最大压摆率 | 0.4 mA | 0.4 mA | - | 0.4 mA | 0.4 mA | - |
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