EEPROM, 1KX16, Serial, CMOS, PDIP8, PLASTIC, DIP-8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP8,.3 |
Reach Compliance Code | compliant |
备用内存宽度 | 8 |
最大时钟频率 (fCLK) | 1 MHz |
数据保留时间-最小值 | 40 |
耐久性 | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDIP-T8 |
长度 | 9.27 mm |
内存密度 | 16384 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 1024 words |
字数代码 | 1000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1KX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | SERIAL |
电源 | 3/5 V |
编程电压 | 3 V |
认证状态 | Not Qualified |
座面最大高度 | 5.33 mm |
串行总线类型 | MICROWIRE |
最大待机电流 | 0.00001 A |
最大压摆率 | 0.003 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
最长写入周期时间 (tWC) | 10 ms |
写保护 | HARDWARE/SOFTWARE |
Base Number Matches | 1 |
AM93LC86N | AM93LC86IS | AM93LC86ISA | AM93LC86IN | AM93LC86S | AM93LC86ITS | AM93LC86ITSA | |
---|---|---|---|---|---|---|---|
描述 | EEPROM, 1KX16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | EEPROM, 1KX16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 1KX16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 1KX16, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | EEPROM, 1KX16, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 1KX16, Serial, CMOS, PDSO8, TSSOP-8 | EEPROM, 1KX16, Serial, CMOS, PDSO8, TSSOP-8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
数据保留时间-最小值 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
长度 | 9.27 mm | 5.05 mm | 5.05 mm | 9.27 mm | 5.05 mm | 4.4 mm | 4.4 mm |
内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
组织 | 1KX16 | 1KX16 | 1KX16 | 1KX16 | 1KX16 | 1KX16 | 1KX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | SOP | DIP | SOP | TSSOP | TSSOP |
封装等效代码 | DIP8,.3 | SOP8,.25 | SOP8,.25 | DIP8,.3 | SOP8,.25 | TSSOP8,.25 | TSSOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.33 mm | 1.75 mm | 1.75 mm | 5.33 mm | 1.75 mm | 1.2 mm | 1.2 mm |
串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
最大待机电流 | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A |
最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | NO | YES | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.05 mm | 3.05 mm |
最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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