ID 1020
V3.00
OSMP Microminiature
Push-On Coaxial Connectors
• Intermateable with Gilbert GPO™ Series
• DESC approved
• Enhanced performance features
• Simplified Assembly
M/A-COM’s OSMP microminiature push-on coaxial connectors
provide solutions for today’s modular designs with denser pack-
aging requirements. The extremely small size of the OSMP
offers a versatile solution for high density packaging allowing
connector center-to-center spacing of 0.170". The push-on
interface facilitates easier assembly and test with a positive
snap-in feature to indicate a fully mated connection. The rugged
OSMP interface can withstand harsh environments of mechani-
cal shock and vibration, typically found in military or aerospace
related applications. M/A-COM’s OSMP connector interface is
the standard used by Defense Electronics Supply Center
(DESC) to generate the SMP push-on connector series.
OSMP connectors can be your design solution for mechanical
packaging and frequency response. The OSMP interface pro-
vides 0.020" of radial misalignment for critical blindmate applica-
tions. Mating forces are strictly controlled to ensure reliable
connections per mated pair or when simultaneously mating mul-
tiple connectors. Cable jacks include an anti-rocking ring to
ensure reliable mechanical performance regardless of the oper-
ating environment. OSMP connectors offer enhanced broadband
VSWR performance of 1.15:1 max thru 26GHz and 1.40:1 max
thru 40GHz.
Standard design OSMP configurations include cable connectors,
straight and right angle, for 0.047 and 0.085 semi-rigid cable,
full detent, limited detent and smooth bore mating shrouds that
can be bulkhead or flange mounted and glass feedthroughs for
coax to circuit launchers. In-series adapters for module to mod-
ule intermating and between series adapters for integrating or
testing systems or components parameters.
OSMP connectors are an ideal solution for upgrading existing
systems or creating new high density designs for next generation
RF packaging. Years of design experience has made M/A-COM
an industry leader in blindmate modular interconnect technology.
Call your local M/A-COM Sales Office or authorized Distributor
for more information or samples of our new OSMP series.
OSMP Shroud and Jack to Jack Adapter Assembly
VSWR
1.50:1
1.40:1
1.30:1
1.20:1
1.10:1
0.0
8.0
16.0
24.0
32.0
40.0 GHz
Typical VSWR for OSMP Jack to Jack Adapter
Part Numbers 2980-0000-62 and 2998-5001-02
Specifications Subject to Change Without Notice.
M/A-COM, Inc.
North America:
Tel. (800) 366-2266
Fax (800) 618-8883
s
1
Asia/Pacific: Tel. +81 3 3263 8761
Fax +81 3 3263 8769
s
Europe: Tel. +44 (1344) 869 595
Fax +44 (1344) 300 020
OSMP
Requirement
General
Materials and Finishes
Dielectric
Shrouds
Hermetic Seal
Specifications
Detail
Housings and Center Contacts
Beryllium Copper per ASTM-B-196; gold plate over nickel plate
PTFE Fluorocarbon per ASTM-D-1457
Stainless steel per ASTM-A582 Type 303; passivate per ASTM-A380
Glass bead
Electrical
Frequency Range
VSWR
dc - 40.0 GHz
1.10:1 Maximum dc - 23.0 GHz
1.15:1 Maximum 23.0 - 26.0 GHz
1.40:1 Maximum 26.0 - 40.0 GHz
335 VRMS maximum at sea level
0.10 f (GHz) maximum
5000 megohms minimum
500 volts (VRMS minimum)
325 volts (VRMS minimum) @ 5 MHz
50 ohms nominal
-80dB to 3 GHz, -65dB from 3 to 26.5 dB minimum
Initial center contact 6.0 milliohms maximum
Outer contact 2.0 milliohms maximum
Voltage Rating
Insertion Loss
Insulation Resistance
Dielectric Withstanding Voltage
RF High Potential
Impedance
RF Leakage
Contact Resistance
Mechanical
Durability
Radial Misalignment
Axial Misalignment
Force to Engage
100 mating cycles minimum
±0.020 minimum
.000/.010
full detent
half detent
smooth bore
full detent
half detent
smooth bore
10.0 lbs. maximum
5.0 lbs. maximum
2.0 lbs. maximum
2.0 lbs. minimum
1.5 lbs. minimum
0.5 lbs. minimum
Force to Disengage
Center Contact Retention
1.5 lbs. minimum axial force
Environmental
Operating Temperature
Vibration
Shock
Thermal Shock
Moisture Resistance
-65°C to +165°C
per MIL-STD-202, method 204, test condition D
per MIL-STD-202, method 213, test condition I
per MIL-STD-202, method 107, test condition B
per MIL-STD-202 method 106, except step 7b shall be omitted. Resistance shall be 200 megohms
within 5 minutes after removal from humidity.
Note: Specifications apply to 2980-0000-62. Performance may vary depending on connector selected.
Specifications Subject to Change Without Notice.
2
North America:
Tel. (800) 366-2266
Fax (800) 618-8883
s
M/A-COM, Inc.
Asia/Pacific: Tel. +81 3 3263 8761
Fax +81 3 3263 8769
s
Europe: Tel. +44 (1344) 869 595
Fax +44 (1344) 300 020
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