Processor Specific Clock Generator, 400MHz, CMOS, PDSO56, LEAD FREE, MO-118, SSOP-56
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | LEAD FREE, MO-118, SSOP-56 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| JESD-30 代码 | R-PDSO-G56 |
| JESD-609代码 | e3 |
| 长度 | 18.43 mm |
| 湿度敏感等级 | 1 |
| 端子数量 | 56 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 最大输出时钟频率 | 400 MHz |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP56,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 主时钟/晶体标称频率 | 14.318 MHz |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.8 mm |
| 最大压摆率 | 350 mA |
| 最大供电电压 | 3.465 V |
| 最小供电电压 | 3.135 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.5 mm |
| uPs/uCs/外围集成电路类型 | CLOCK GENERATOR, PROCESSOR SPECIFIC |
| Base Number Matches | 1 |
| ICS932S421CFLF | ICS932S421CGLFT | ICS932S421CGLF | ICS932S421CFLFT | |
|---|---|---|---|---|
| 描述 | Processor Specific Clock Generator, 400MHz, CMOS, PDSO56, LEAD FREE, MO-118, SSOP-56 | Clock Generator, PDSO56 | Processor Specific Clock Generator, 400MHz, CMOS, PDSO56, 0.240 INCH, 0.020 INCH PITCH, LEAD FREE, MO-153, TSSOP-56 | Clock Generator, PDSO56 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 |
| JESD-609代码 | e3 | e3 | e3 | e3 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 端子数量 | 56 | 56 | 56 | 56 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | TSSOP | TSSOP | SSOP |
| 封装等效代码 | SSOP56,.4 | TSSOP56,.3,20 | TSSOP56,.3,20 | SSOP56,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 350 mA | 350 mA | 350 mA | 350 mA |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.5 mm | 0.5 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 包装说明 | LEAD FREE, MO-118, SSOP-56 | 6.10 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-153, TSSOP-56 | TSSOP, TSSOP56,.3,20 | - |
| 厂商名称 | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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