F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20
参数名称 | 属性值 |
包装说明 | DIP, |
Reach Compliance Code | unknown |
系列 | F/FAST |
JESD-30 代码 | R-GDIP-T20 |
长度 | 24.51 mm |
逻辑集成电路类型 | BUS DRIVER |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
传播延迟(tpd) | 8 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
Base Number Matches | 1 |
74F373DCQR | 74F373SCQR | 74F373LCQR | 74F373LC | 74F373QCQR | 74F373FC | 74F373FCQR | |
---|---|---|---|---|---|---|---|
描述 | F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, SOIC-20 | F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, PQCC20, PLASTIC, CC-20 | F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 |
包装说明 | DIP, | SOP, | QCCN, | QCCN, | QCCJ, | DFP, | DFP, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
JESD-30 代码 | R-GDIP-T20 | R-PDSO-G20 | S-CQCC-N20 | S-CQCC-N20 | S-PQCC-J20 | R-GDFP-F20 | R-GDFP-F20 |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | SOP | QCCN | QCCN | QCCJ | DFP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK |
传播延迟(tpd) | 8 ns | 8 ns | 8 ns | 8 ns | 8 ns | 8 ns | 8 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 2.65 mm | 1.905 mm | 1.905 mm | 4.57 mm | 2.286 mm | 2.286 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | YES | YES | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | GULL WING | NO LEAD | NO LEAD | J BEND | FLAT | FLAT |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL |
宽度 | 7.62 mm | 7.5 mm | 8.89 mm | 8.89 mm | 8.89 mm | 6.731 mm | 6.731 mm |
长度 | 24.51 mm | 12.8 mm | 8.89 mm | 8.89 mm | 8.89 mm | - | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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