Counter, Asynchronous, Up Direction, CMOS, CDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
计数方向 | UP |
JESD-30 代码 | R-XDIP-T16 |
JESD-609代码 | e0 |
负载/预设输入 | NO |
工作模式 | ASYNCHRONOUS |
功能数量 | 2 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
74HCT390C | 54HCT390C | 54HCT390D | 74HCT390D | 74HCT390P | |
---|---|---|---|---|---|
描述 | Counter, Asynchronous, Up Direction, CMOS, CDIP16 | Counter, Asynchronous, Up Direction, CMOS, CDIP16 | Counter, Asynchronous, Up Direction, CMOS, CDIP16 | Decade Counter, Asynchronous, Up Direction, CMOS, CDIP16 | Decade Counter, Asynchronous, Up Direction, CMOS, PDIP16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
计数方向 | UP | UP | UP | UP | UP |
JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
负载/预设输入 | NO | NO | NO | NO | NO |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | - |
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