NAND Gate, TTL, PDIP14,
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | compliant |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e0 |
逻辑集成电路类型 | NAND GATE |
最大I(ol) | 0.02 A |
湿度敏感等级 | 2A |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | OPEN-COLLECTOR |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 250 |
最大电源电流(ICC) | 40 mA |
Prop。Delay @ Nom-Sup | 15 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
Base Number Matches | 1 |
74H01PC | 54H01DM | 7401PC | 5401FMQC | 74H01DC | 7401FC | 74H01FC | 7401DC | |
---|---|---|---|---|---|---|---|---|
描述 | NAND Gate, TTL, PDIP14, | NAND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, 74 Series, 4-Func, 2-Input, TTL, PDIP14, PLASTIC, DIP-14 | NAND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, FP-14 | NAND Gate, TTL, CDIP14, | NAND Gate, TTL, CDFP14, | NAND Gate, TTL, CDFP14, | NAND Gate, TTL, CDIP14, |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, | DIP, DIP14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | compliant | compliant | unknown | unknown | compliant | compliant | compliant | compliant |
JESD-30 代码 | R-PDIP-T14 | R-CDIP-T14 | R-PDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-XDIP-T14 |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | UNSPECIFIED | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DFP | DIP | DFP | DFP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | YES | NO | YES | YES | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
是否无铅 | 含铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
最大I(ol) | 0.02 A | 0.02 A | 0.016 A | - | 0.02 A | 0.016 A | 0.02 A | 0.016 A |
湿度敏感等级 | 2A | 2A | - | - | 2A | 2A | 2A | 2A |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | - | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 |
峰值回流温度(摄氏度) | 250 | 250 | NOT SPECIFIED | - | 250 | 250 | 250 | 250 |
最大电源电流(ICC) | 40 mA | 40 mA | 22 mA | - | 40 mA | 22 mA | 40 mA | 22 mA |
Prop。Delay @ Nom-Sup | 15 ns | 15 ns | 45 ns | - | 15 ns | 45 ns | 15 ns | 45 ns |
施密特触发器 | NO | NO | NO | - | NO | NO | NO | NO |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | - | 30 | 30 | 30 | 30 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
厂商名称 | - | Fairchild | Fairchild | Fairchild | - | - | Fairchild | Fairchild |
标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | - | 5 V | - | 5 V |
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