R-S Latch, HCT Series, 4-Func, Low Level Triggered, 2-Bit, True Output, CMOS, PDSO16, PLASTIC, SOP-16
参数名称 | 属性值 |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 16 |
Reach Compliance Code | unknown |
其他特性 | WITH DUAL S INPUT FOR TWO FUNCTIONS |
系列 | HCT |
JESD-30 代码 | R-PDSO-G16 |
长度 | 9.9 mm |
逻辑集成电路类型 | R-S LATCH |
位数 | 2 |
功能数量 | 4 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
传播延迟(tpd) | 45 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
触发器类型 | LOW LEVEL |
宽度 | 3.9 mm |
Base Number Matches | 1 |
DV74HCT279D | DV74HC279N | DV74HCT279N | DV74HC279D | |
---|---|---|---|---|
描述 | R-S Latch, HCT Series, 4-Func, Low Level Triggered, 2-Bit, True Output, CMOS, PDSO16, PLASTIC, SOP-16 | R-S Latch, HC/UH Series, 4-Func, Low Level Triggered, 2-Bit, True Output, CMOS, PDIP16, PLASTIC, DIP-16 | R-S Latch, HCT Series, 4-Func, Low Level Triggered, 2-Bit, True Output, CMOS, PDIP16, PLASTIC, DIP-16 | R-S Latch, HC/UH Series, 4-Func, Low Level Triggered, 2-Bit, True Output, CMOS, PDSO16, PLASTIC, SOP-16 |
零件包装代码 | SOIC | DIP | DIP | SOIC |
包装说明 | SOP, | DIP, | DIP, | SOP, |
针数 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
其他特性 | WITH DUAL S INPUT FOR TWO FUNCTIONS | WITH DUAL S INPUT FOR TWO FUNCTIONS | WITH DUAL S INPUT FOR TWO FUNCTIONS | WITH DUAL S INPUT FOR TWO FUNCTIONS |
系列 | HCT | HC/UH | HCT | HC/UH |
JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 |
长度 | 9.9 mm | 19.175 mm | 19.175 mm | 9.9 mm |
逻辑集成电路类型 | R-S LATCH | R-S LATCH | R-S LATCH | R-S LATCH |
位数 | 2 | 2 | 2 | 2 |
功能数量 | 4 | 4 | 4 | 4 |
端子数量 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DIP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
传播延迟(tpd) | 45 ns | 180 ns | 45 ns | 180 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 4.44 mm | 4.44 mm | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V | 6 V | 5.5 V | 6 V |
最小供电电压 (Vsup) | 4.5 V | 2 V | 4.5 V | 2 V |
标称供电电压 (Vsup) | 5 V | 4.5 V | 5 V | 4.5 V |
表面贴装 | YES | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
触发器类型 | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL |
宽度 | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm |
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