Flash, 256KX8, PDSO8, LEAD FREE, TSSOP-8
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
包装说明 | TSSOP, TSSOP8,.25 |
Reach Compliance Code | compliant |
最大时钟频率 (fCLK) | 100 MHz |
数据保留时间-最小值 | 20 |
耐久性 | 100000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 |
长度 | 4.4 mm |
内存密度 | 2097152 bit |
内存集成电路类型 | FLASH |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
组织 | 256KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL |
电源 | 3/3.3 V |
编程电压 | 2.7 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
串行总线类型 | SPI |
最大待机电流 | 0.00001 A |
最大压摆率 | 0.03 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
类型 | NOR TYPE |
宽度 | 3 mm |
写保护 | HARDWARE/SOFTWARE |
Base Number Matches | 1 |
IS25LD020-JDLA2 | IS25LD020-JVLA1 | IS25LD020-JVLA2 | IS25LD020-JVLE | IS25LD020-JDLA1 | IS25LD020-JNLA1 | IS25LD020-JNLA2 | |
---|---|---|---|---|---|---|---|
描述 | Flash, 256KX8, PDSO8, LEAD FREE, TSSOP-8 | Flash, 256KX8, PDSO8, 0.150 INCH, LEAD FREE, VVSOP-8 | Flash, 256KX8, PDSO8, 0.150 INCH, LEAD FREE, VVSOP-8 | Flash, 256KX8, PDSO8, 0.150 INCH, LEAD FREE, VVSOP-8 | Flash, 256KX8, PDSO8, LEAD FREE, TSSOP-8 | Flash, 256KX8, PDSO8, 0.150 INCH, LEAD FREE, SOIC-8 | Flash, 256KX8, PDSO8, 0.150 INCH, LEAD FREE, SOIC-8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | TSSOP, TSSOP8,.25 | VSOP, TSOP8,.25 | VSOP, TSOP8,.25 | VSOP, TSOP8,.25 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
最大时钟频率 (fCLK) | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
数据保留时间-最小值 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
长度 | 4.4 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.4 mm | 4.9 mm | 4.9 mm |
内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 105 °C | 85 °C | 105 °C | 105 °C | 85 °C | 85 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | VSOP | VSOP | VSOP | TSSOP | SOP | SOP |
封装等效代码 | TSSOP8,.25 | TSOP8,.25 | TSOP8,.25 | TSOP8,.25 | TSSOP8,.25 | SOP8,.25 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
编程电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 0.88 mm | 0.88 mm | 0.88 mm | 1.2 mm | 1.75 mm | 1.75 mm |
串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
最大待机电流 | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A |
最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 3 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3 mm | 3.9 mm | 3.9 mm |
写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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