FIFO, 16KX36, Synchronous, CMOS, PQFP128, TQFP-128
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, |
| 针数 | 128 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 周期时间 | 20 ns |
| JESD-30 代码 | R-PQFP-G128 |
| JESD-609代码 | e0 |
| 长度 | 20 mm |
| 内存密度 | 589824 bit |
| 内存宽度 | 36 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 128 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16KX36 |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| IDT72V3686L20PF | IDT72V3666L20PF | IDT72V3676L20PF | IDT72V3656L20PF | IDT72V36106L20PF | IDT72V3696L20PF | IDT72V3696L20PFG | IDT72V3686L20PFG | |
|---|---|---|---|---|---|---|---|---|
| 描述 | FIFO, 16KX36, Synchronous, CMOS, PQFP128, TQFP-128 | FIFO, 4KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128 | FIFO, 8KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128 | FIFO, 2KX36, 12ns, Synchronous, CMOS, PQFP128, TQFP-128 | FIFO, 64KX36, Synchronous, CMOS, PQFP128, TQFP-128 | FIFO, 32KX36, Synchronous, CMOS, PQFP128, TQFP-128 | FIFO, 32KX36, Synchronous, CMOS, PQFP128, TQFP-128 | FIFO, 16KX36, Synchronous, CMOS, PQFP128, TQFP-128 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | LFQFP, | LFQFP, | LFQFP, | TQFP-128 | LFQFP, | LFQFP, | LFQFP, | LFQFP, |
| 针数 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 周期时间 | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| JESD-30 代码 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e3 | e3 |
| 长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
| 内存密度 | 589824 bit | 147456 bit | 294912 bit | 73728 bit | 2359296 bit | 1179648 bit | 1179648 bit | 589824 bit |
| 内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| 字数 | 16384 words | 4096 words | 8192 words | 2048 words | 65536 words | 32768 words | 32768 words | 16384 words |
| 字数代码 | 16000 | 4000 | 8000 | 2000 | 64000 | 32000 | 32000 | 16000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 16KX36 | 4KX36 | 8KX36 | 2KX36 | 64KX36 | 32KX36 | 32KX36 | 16KX36 |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 | 240 | 240 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 20 | 30 | 30 |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| 厂商名称 | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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