IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D LATCH |
| 最大I（ol） | 0.048 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 5.2 ns |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74FCT533ADCQR | 54FCT533DMQR | 54FCT533LMQR | 54FCT533ALMQR | 54FCT533ADMQR | 54FCT533FMQR | 74FCT533ALCX | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC | 54FCT533DMQR | 54FCT533LMQR | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC | 54FCT533FMQR | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC |
| 包装说明 | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T20 | R-PDIP-T20 | S-XQCC-N20 | S-XQCC-N20 | R-XDIP-T20 | R-XDFP-F20 | S-XQCC-N20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| 最大I（ol） | 0.048 A | 0.048 A | 0.048 A | 0.032 A | 0.032 A | 0.048 A | 0.048 A |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | QCCN | QCCN | DIP | DFP | QCCN |
| 封装等效代码 | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | LCC20,.35SQ | DIP20,.3 | FL20,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | e0 | e0 | - | - | e0 | e0 |
| Prop。Delay @ Nom-Sup | 5.2 ns | - | 10 ns | - | - | 10 ns | 5.2 ns |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 厂商名称 | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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