Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PQCC44, PLASTIC, LCC-44
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | LCC |
| 包装说明 | PLASTIC, LCC-44 |
| 针数 | 44 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A991.A.2 |
| 具有ADC | NO |
| 地址总线宽度 | 16 |
| 位大小 | 8 |
| CPU系列 | 8051 |
| 最大时钟频率 | 40 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | S-PQCC-J44 |
| JESD-609代码 | e0 |
| 长度 | 16.59 mm |
| I/O 线路数量 | 32 |
| 端子数量 | 44 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC44,.7SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 256 |
| ROM（单词） | 8192 |
| ROM可编程性 | FLASH |
| 座面最大高度 | 4.699 mm |
| 速度 | 12 MHz |
| 最大压摆率 | 50 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 16.59 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Base Number Matches | 1 |
| W78E52P-24 | W78E52F-40 | W78E52F-24 | W78E52P-16 | W78E52-24 | W78E52M-40 | W78E52-16 | W78E52-40 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44 | Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, QFP-44 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 12MHz, CMOS, PDIP40, DIP-40 | Microcontroller, 8-Bit, FLASH, CMOS, PQFP44, TQFP-44 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 8MHz, CMOS, PDIP40, DIP-40 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 20MHz, CMOS, PDIP40, DIP-40 |
| 零件包装代码 | LCC | QFP | QFP | LCC | DIP | QFP | DIP | DIP |
| 包装说明 | PLASTIC, LCC-44 | QFP, | QFP, | PLASTIC, LCC-44 | DIP-40 | TQFP, | DIP-40 | DIP-40 |
| 针数 | 44 | 44 | 44 | 44 | 40 | 44 | 40 | 40 |
| Reach Compliance Code | not_compliant | unknown | unknown | not_compliant | not_compliant | unknown | _compli | _compli |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| 具有ADC | NO | NO | NO | NO | NO | NO | NO | NO |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | S-PQCC-J44 | S-PQFP-G44 | S-PQFP-G44 | S-PQCC-J44 | R-PDIP-T40 | S-PQFP-G44 | R-PDIP-T40 | R-PDIP-T40 |
| 长度 | 16.59 mm | 10 mm | 10 mm | 16.59 mm | 52.2 mm | 10 mm | 52.2 mm | 52.2 mm |
| I/O 线路数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 44 | 44 | 44 | 44 | 40 | 44 | 40 | 40 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QFP | QFP | QCCJ | DIP | TQFP | DIP | DIP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK, THIN PROFILE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 座面最大高度 | 4.699 mm | 2.7 mm | 2.7 mm | 4.699 mm | 5.334 mm | 1.2 mm | 5.334 mm | 5.334 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | GULL WING | GULL WING | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 2.54 mm | 0.8 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 16.59 mm | 10 mm | 10 mm | 16.59 mm | 15.24 mm | 10 mm | 15.24 mm | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | - | 不符合 | 不符合 |
| CPU系列 | 8051 | - | - | 8051 | 8051 | - | 8051 | 8051 |
| JESD-609代码 | e0 | - | - | e0 | e0 | - | e0 | e0 |
| 封装等效代码 | LDCC44,.7SQ | - | - | LDCC44,.7SQ | DIP40,.6 | - | DIP40,.6 | DIP40,.6 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | - | - | 5 V | 5 V | - | 5 V | 5 V |
| RAM（字节） | 256 | - | - | 256 | 256 | - | 256 | 256 |
| ROM（单词） | 8192 | - | - | 8192 | 8192 | - | 8192 | 8192 |
| 速度 | 12 MHz | - | - | 8 MHz | 12 MHz | - | 8 MHz | 20 MHz |
| 最大压摆率 | 50 mA | - | - | 50 mA | 50 mA | - | 50 mA | 50 mA |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 厂商名称 | - | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
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