US3AB thru US3MB
SURFACE MOUNT REVERSE VOLTAGE 50 TO 1000 VOLTS
ULTRA FAST RECTIFIERS FORWARD
CURRENT - 3.0 AMPERES
SMB/DO-214AA
.075(1.91)
.083(2.11)
.130(3.30)
.155(3.94)
.160(4.06)
.185(4.70)
.006(.152)
.012(.305)
.083(2.13)
.096(2.44)
.030(0.76)
.050(1.27)
.004(.102)
.008(.203)
.200(5.08)
.220(5.59)
Dimensions in inches and (millimeters)
FEATURES
For surface mounted applications
Low profile package
Built-in strain relief
Easy pick and place
Ultrafast recovery times for high efficiency
Plastic package has Underwriters Laboratory
Flammability classification 94V-0
Glass passivated junction
High temperature soldering
260
o
C/10seconds at terminals
MECHANICAL DATA
Case JEDEC DO-214AA molded plastic
Terminals Solder plated, solderable per
MIL-STD-750, Method 2026
Polarity Indicated by cathode band
Standard Packaging 12mm tape (ELA-481)
Weight 0.21grams
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temperature unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load
For capacitive load, derate current by 20%
SYMBOL US3AB US3BB US3DB US3FB US3GB US3JB US3KB US3MB
UNITS
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current @ T
L
=100 C
Peak Forward Surge Current 8.3ms Single Half Sine-Wave
Superimposed on Rated Load (JEDEC Method) T
A
=55
0
C
MaximumInstantaneous Forward Voltage at 3.0A DC
Maximum DC Reverse Current @T
A
=25
0
C
at Rated DC Blocking Voltage @T
A
=125
0
C
Typical Junctionn Capacitance (NOTE 2)
Maximum Reverse Recovery Time (NOTE 1) T
J
=25
0
C
Maximum Thermal Resistance (NOTE 3)
Operating and Storage Temperature Range
0
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
C
J
T
RR
T
J
T
STG
50
35
50
100
70
100
200
140
200
300
210
300
3.0
400
280
400
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amps
Amps
150
1.0
10
250
50
80
75
50
1.3
1.7
Volts
A
pF
nS
0
-55 to +150
-55 to +150
C
C
0
NOTES
1. Rverse Recovery Test Condibons I
F
=5A, I
R
=1A, l
RR
=0.25A
2. Measured at 1 MHz and applied reverse Voltag of 4.0VDC
3. Measured on P
.C.Board with 0.6 x0.6 (16mmX16mm) Copper Pad Area.
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US3AB thru US3MB
SURFACE MOUNT REVERSE VOLTAGE 50 TO 1000 VOLTS
RATING AND CHARACTERISTICS CURVES US3AB THRU US3MB
FORWARD CURRENT RATING
Fig. 1 - REVERSE RECOVERY TIME CHARACTERISTIC
AND TEST CIRCUIT DIAGRAM
50
Noninductive
10
Noninductive
AVERAGE FORWARD CURRENT,
AMPERES
3.0
2.5
2.0
1.5
1.0
0.5
0
50
60
70
80
90 100 110 120 130 140 150
LEAD TEMPERATURE,
o
C
SINGLE PHASE
HALF W AVE
60H
Z
RESISTIVE OR
INDUCTIVE LOAD
P.C.B MOUNTED
ON 0.315x0.315"(8.0x8.0mm)
COPPER PAD AREAS
trr
+0.5A
( )
PULSE
GENERATOR
NOTE 2
(+)
25 Vdc
(approx)
( )
D.U.T.
0
-0.25
1
NON-
Inductive
OSCILLOSCOPE
NOTE 1
(+)
NOTES:1. Rise Time=7ns max.
Input Impedance=1 megohm. 22pF
2. Rise Time=10ns max.
Source Impedance=50 Ohms.
-1.0
SET TIME
BASE FOR
10ns/cm
1cm
Fig. 3 - TYPICAL REVERSE CHARACTERISTICS
INSTANTANEOUS REVERSE LEAKAGE CURRENT,
MICROAMPERES
100
Fig. 4 - TYPICAL FORWARD CHARACTERISTICS
100
INSTANTANEOUS FORWARD CURRENT, AMPERES
10.0
0
TJ=150C
10.0
US3AB
thru
US3DB
US3GB
0
TJ=100C
1.0
0
TJ=25C
US3MB
1.0
0.1
0.1
0
TJ=25C
Pulse Width=300 s
2% Duly Cycle
01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE, VOLTS
0.01
0.4 0.6
0.8
1.0
1.2
1.4
1.6
1.8
INSTANTANEOUS FORWARD VOLTAGE. VOLTS
Fig. 5 - MAXIMUM NON-REPETITIVE
PEAK FORWARD SURGE CURRENT
PEAK FORWARD SURGE CURRENT,
AMPERES
200
Fig. 6 - TYPICAL JUNCTION CAPACITANCE
160
140
CAPACITANCE, pF
0
TJ=25C
f=1MHz
Vslg=50mVp-p
100
120
100
80
60
40
US3GB
thru
US3MB
US3AB
thru
US3DB
50
8.3ms SINGLE HALF SINCE-WAVE
JEDEC METHOD
10
1
5
10
50
100
NUMBER OF CYCLES AT 60H
Z
20
.1
.5
1.0 2.0
5.0 10.0 20
50 100 200
500 1000
REVERSE VOLTAGE, VOLTS
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