IC,DRAM,PAGE MODE,256KX1,MOS,DIP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 120 ns |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | R-PDIP-T16 |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | PAGE MODE DRAM |
| 内存宽度 | 1 |
| 端子数量 | 16 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX1 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 256 |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | MOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-01-266-2044 | UPD41256V-20 | UPD41256V-12 | UPD41256L-20 | UPD41256D-20 | 5962-01-270-0685 | |
|---|---|---|---|---|---|---|
| 描述 | IC,DRAM,PAGE MODE,256KX1,MOS,DIP,16PIN,PLASTIC | IC,DRAM,PAGE MODE,256KX1,MOS,ZIP,16PIN,PLASTIC | IC,DRAM,PAGE MODE,256KX1,MOS,ZIP,16PIN,PLASTIC | IC,DRAM,PAGE MODE,256KX1,MOS,LDCC,18PIN,PLASTIC | IC,DRAM,PAGE MODE,256KX1,MOS,DIP,16PIN,CERAMIC | IC,DRAM,PAGE MODE,256KX1,MOS,DIP,16PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 120 ns | 200 ns | 120 ns | 200 ns | 200 ns | 150 ns |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-PDIP-T16 | R-PZIP-T16 | R-PZIP-T16 | R-PQCC-J18 | R-XDIP-T16 | R-PDIP-T16 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM | PAGE MODE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 18 | 16 | 16 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | ZIP | ZIP | QCCJ | DIP | DIP |
| 封装等效代码 | DIP16,.3 | ZIP16,.1 | ZIP16,.1 | LDCC18,.33X.53 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 256 | 256 | 256 | 256 | 256 | 256 |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | NO | NO |
| 技术 | MOS | MOS | MOS | MOS | MOS | MOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | ZIG-ZAG | ZIG-ZAG | QUAD | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
| 包装说明 | - | ZIP, ZIP16,.1 | ZIP, ZIP16,.1 | QCCJ, LDCC18,.33X.53 | DIP, DIP16,.3 | - |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | - |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
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