4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE
| A42U2604V | A42U2604 | 5066 | A42U2604S | A42U2604V-60 | A42U2604V-60U | A42U2604V-80 | A42U2604V-80U | A42U2604V-50U | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE | 4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE | Do-It-Yourself Male BNC Connector with Strain Relief Boot For RG 58 and 141 Coax cable | 4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE | 4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE | 4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE | 4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE | 4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE | 4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE |
| 是否Rohs认证 | - | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | - | - | - | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] |
| 包装说明 | - | - | - | - | TSOP2, TSOP24/26,.36 | TSOP2, TSOP24/26,.36 | TSOP2, TSOP24/26,.36 | TSOP2, TSOP24/26,.36 | TSOP2, TSOP24/26,.36 |
| Reach Compliance Code | - | - | - | - | unknow | unknow | unknow | unknow | unknow |
| 访问模式 | - | - | - | - | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | - | - | - | - | 60 ns | 60 ns | 80 ns | 80 ns | 50 ns |
| 其他特性 | - | - | - | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH |
| I/O 类型 | - | - | - | - | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | - | - | - | - | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | - | - | - | - | e0 | e0 | e0 | e0 | e0 |
| 长度 | - | - | - | - | 17.14 mm | 17.14 mm | 17.14 mm | 17.14 mm | 17.14 mm |
| 内存密度 | - | - | - | - | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi | 16777216 bi |
| 内存集成电路类型 | - | - | - | - | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
| 内存宽度 | - | - | - | - | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | - | - | - | - | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | - | - | - | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | - | - | - | 24 | 24 | 24 | 24 | 24 |
| 字数 | - | - | - | - | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | - | - | - | - | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | - | - | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | - | - | - | - | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| 组织 | - | - | - | - | 4MX4 | 4MX4 | 4MX4 | 4MX4 | 4MX4 |
| 输出特性 | - | - | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | - | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | - | - | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
| 封装等效代码 | - | - | - | - | TSOP24/26,.36 | TSOP24/26,.36 | TSOP24/26,.36 | TSOP24/26,.36 | TSOP24/26,.36 |
| 封装形状 | - | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | - | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 电源 | - | - | - | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 认证状态 | - | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | - | - | - | - | 2048 | 2048 | 2048 | 2048 | 2048 |
| 座面最大高度 | - | - | - | - | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 自我刷新 | - | - | - | - | YES | YES | YES | YES | YES |
| 最大待机电流 | - | - | - | - | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A |
| 最大压摆率 | - | - | - | - | 0.065 mA | 0.065 mA | 0.06 mA | 0.06 mA | 0.07 mA |
| 最大供电电压 (Vsup) | - | - | - | - | 2.75 V | 2.75 V | 2.75 V | 2.75 V | 2.75 V |
| 最小供电电压 (Vsup) | - | - | - | - | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V |
| 标称供电电压 (Vsup) | - | - | - | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | - | - | - | - | YES | YES | YES | YES | YES |
| 技术 | - | - | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | - | - | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | - | - | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | - | - | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | - | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | - | - | - | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
汽车电子
模拟电子
微控制器 MCU
stm32/stm8
嵌入式系统
汽车电子
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
