Power Field-Effect Transistor, 34A I(D), 100V, 0.076ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AE, HERMETIC SEALED, TO-204AE, 2 PIN
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | BFM |
包装说明 | FLANGE MOUNT, O-CBFM-P2 |
针数 | 2 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
其他特性 | HIGH RELIABILITY |
雪崩能效等级(Eas) | 500 mJ |
外壳连接 | DRAIN |
配置 | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 100 V |
最大漏极电流 (ID) | 34 A |
最大漏源导通电阻 | 0.076 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95代码 | TO-204AE |
JESD-30 代码 | O-CBFM-P2 |
元件数量 | 1 |
端子数量 | 2 |
工作模式 | ENHANCEMENT MODE |
最高工作温度 | 150 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | ROUND |
封装形式 | FLANGE MOUNT |
峰值回流温度(摄氏度) | 260 |
极性/信道类型 | N-CHANNEL |
最大脉冲漏极电流 (IDM) | 136 A |
认证状态 | Not Qualified |
表面贴装 | NO |
端子形式 | PIN/PEG |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 40 |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
Base Number Matches | 1 |
IRH3150PBF | IRH8150PBF | IRH4150PBF | IRH7150PBF | |
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描述 | Power Field-Effect Transistor, 34A I(D), 100V, 0.076ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AE, HERMETIC SEALED, TO-204AE, 2 PIN | Power Field-Effect Transistor, 34A I(D), 100V, 0.076ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AE, HERMETIC SEALED, TO-204AE, 2 PIN | Power Field-Effect Transistor, 34A I(D), 100V, 0.076ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AE, HERMETIC SEALED, TO-204AE, 2 PIN | Power Field-Effect Transistor, 34A I(D), 100V, 0.076ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AE, HERMETIC SEALED, TO-204AE, 2 PIN |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | BFM | BFM | BFM | BFM |
包装说明 | FLANGE MOUNT, O-CBFM-P2 | FLANGE MOUNT, O-CBFM-P2 | FLANGE MOUNT, O-CBFM-P2 | FLANGE MOUNT, O-CBFM-P2 |
针数 | 2 | 2 | 2 | 2 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY |
雪崩能效等级(Eas) | 500 mJ | 500 mJ | 500 mJ | 500 mJ |
外壳连接 | DRAIN | DRAIN | DRAIN | DRAIN |
配置 | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 100 V | 100 V | 100 V | 100 V |
最大漏极电流 (ID) | 34 A | 34 A | 34 A | 34 A |
最大漏源导通电阻 | 0.076 Ω | 0.076 Ω | 0.076 Ω | 0.076 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95代码 | TO-204AE | TO-204AE | TO-204AE | TO-204AE |
JESD-30 代码 | O-CBFM-P2 | O-CBFM-P2 | O-CBFM-P2 | O-CBFM-P2 |
元件数量 | 1 | 1 | 1 | 1 |
端子数量 | 2 | 2 | 2 | 2 |
工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | ROUND | ROUND | ROUND | ROUND |
封装形式 | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
最大脉冲漏极电流 (IDM) | 136 A | 136 A | 136 A | 136 A |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | NO |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON |
Base Number Matches | 1 | 1 | 1 | 1 |
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