IC DUAL LINE DRIVER, CDFP16, CERAMIC, FP-16, Line Driver or Receiver
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DFP, FL16,.3 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
其他特性 | CONFIGURABLE INTERFACE STANDARDS; INDIVIDUAL ENABLES |
差分输出 | YES |
驱动器位数 | 2 |
高电平输入电流最大值 | 0.00004 A |
输入特性 | STANDARD |
接口集成电路类型 | LINE DRIVER |
接口标准 | GENERAL PURPOSE |
JESD-30 代码 | R-GDFP-F16 |
JESD-609代码 | e0 |
长度 | 9.6645 mm |
功能数量 | 2 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
最小输出摆幅 | 2 V |
输出特性 | 3-STATE |
输出极性 | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
电源 | 5 V |
认证状态 | Not Qualified |
最大接收延迟 | |
筛选级别 | MIL-STD-883 |
座面最大高度 | 2.032 mm |
最大压摆率 | 90 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
最大传输延迟 | 42 ns |
宽度 | 6.604 mm |
Base Number Matches | 1 |
8004101FA | 8004102EA | 8004102FA | |
---|---|---|---|
描述 | IC DUAL LINE DRIVER, CDFP16, CERAMIC, FP-16, Line Driver or Receiver | IC LINE DRIVER, CDIP16, CERAMIC, DIP-16, Line Driver or Receiver | IC LINE DRIVER, CDFP16, CERPACK-16, Line Driver or Receiver |
包装说明 | DFP, FL16,.3 | DIP, | DFP, |
Reach Compliance Code | compliant | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 |
其他特性 | CONFIGURABLE INTERFACE STANDARDS; INDIVIDUAL ENABLES | CONFIGURABLE INTERFACE STANDARDS; INDIVIDUAL ENABLES | CONFIGURABLE INTERFACE STANDARDS; INDIVIDUAL ENABLES |
差分输出 | YES | YES | YES |
驱动器位数 | 2 | 2 | 2 |
输入特性 | STANDARD | STANDARD | STANDARD |
接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER |
接口标准 | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE |
JESD-30 代码 | R-GDFP-F16 | R-GDIP-T16 | R-GDFP-F16 |
长度 | 9.6645 mm | 19.43 mm | 9.6645 mm |
功能数量 | 2 | 1 | 1 |
端子数量 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DFP | DIP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.032 mm | 5.08 mm | 2.032 mm |
最大压摆率 | 90 mA | 90 mA | 90 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES |
温度等级 | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL |
最大传输延迟 | 42 ns | 25 ns | 25 ns |
宽度 | 6.604 mm | 7.62 mm | 6.604 mm |
Base Number Matches | 1 | 1 | 1 |
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