IC,VOLT COMPARATOR,DUAL,BIPOLAR,LLCC,20PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| Reach Compliance Code | not_compliant |
| 放大器类型 | COMPARATOR |
| 最大输入失调电压 | 9000 µV |
| JESD-30 代码 | S-XQCC-N20 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| LM193FK/883B | LM2903JG/883B | LM393P3 | LM193JG/883B | LM193LB | |
|---|---|---|---|---|---|
| 描述 | IC,VOLT COMPARATOR,DUAL,BIPOLAR,LLCC,20PIN,CERAMIC | IC,VOLT COMPARATOR,DUAL,BIPOLAR,DIP,8PIN,CERAMIC | IC IC,VOLT COMPARATOR,DUAL,BIPOLAR,DIP,8PIN,PLASTIC, Comparator | IC,VOLT COMPARATOR,DUAL,BIPOLAR,DIP,8PIN,CERAMIC | IC,VOLT COMPARATOR,DUAL,BIPOLAR,CAN,8PIN,METAL |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| 最大输入失调电压 | 9000 µV | 15000 µV | 9000 µV | 9000 µV | 9000 µV |
| JESD-30 代码 | S-XQCC-N20 | R-XDIP-T8 | R-PDIP-T8 | R-XDIP-T8 | O-MBCY-W8 |
| 端子数量 | 20 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 85 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | - | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | METAL |
| 封装等效代码 | LCC20,.35SQ | DIP8,.3 | DIP8,.3 | DIP8,.3 | CAN8,.2 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CYLINDRICAL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | INDUSTRIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | WIRE |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | BOTTOM |
| 封装代码 | QCCN | DIP | DIP | DIP | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class B (Modified) | 38535Q/M;38534H;883B |
| 表面贴装 | YES | NO | NO | NO | - |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
| Base Number Matches | 1 | 1 | 1 | - | - |
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