Support Circuit, 1-Func, PBGA256, BGA-256
参数名称 | 属性值 |
零件包装代码 | BGA |
包装说明 | LBGA, |
针数 | 256 |
Reach Compliance Code | unknown |
JESD-30 代码 | S-PBGA-B256 |
JESD-609代码 | e0 |
长度 | 17 mm |
功能数量 | 1 |
端子数量 | 256 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE |
认证状态 | Not Qualified |
座面最大高度 | 1.5 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
电信集成电路类型 | ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
宽度 | 17 mm |
Base Number Matches | 1 |
IDT77V400S155BCI | IDT77V400S155DSI8 | IDT77V400S155DSI9 | IDT77V400S155DS8 | IDT77V400S155DS9 | IDT77V400S155BC | |
---|---|---|---|---|---|---|
描述 | Support Circuit, 1-Func, PBGA256, BGA-256 | Support Circuit, 1-Func, PQFP208, PLASTIC, QFP-208 | Support Circuit, 1-Func, PQFP208, PLASTIC, QFP-208 | Support Circuit, 1-Func, PQFP208, PLASTIC, QFP-208 | Support Circuit, 1-Func, PQFP208, PLASTIC, QFP-208 | Support Circuit, 1-Func, PBGA256, BGA-256 |
零件包装代码 | BGA | QFP | QFP | QFP | QFP | BGA |
包装说明 | LBGA, | FQFP, | FQFP, | FQFP, | FQFP, | LBGA, |
针数 | 256 | 208 | 208 | 208 | 208 | 256 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | S-PBGA-B256 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PBGA-B256 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 17 mm | 28 mm | 28 mm | 28 mm | 28 mm | 17 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 256 | 208 | 208 | 208 | 208 | 256 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | FQFP | FQFP | FQFP | FQFP | LBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | GRID ARRAY, LOW PROFILE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.5 mm | 3.86 mm | 3.86 mm | 3.86 mm | 3.86 mm | 1.5 mm |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
电信集成电路类型 | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | BALL | GULL WING | GULL WING | GULL WING | GULL WING | BALL |
端子节距 | 1 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1 mm |
端子位置 | BOTTOM | QUAD | QUAD | QUAD | QUAD | BOTTOM |
宽度 | 17 mm | 28 mm | 28 mm | 28 mm | 28 mm | 17 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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