RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Features:
•
•
•
•
•
•
Stackpole Electronics, Inc.
Resistive Product Solutions
Higher power ratings than standard thick film chips
Absolute TCRs to ±100 ppm/°C
Inner termination engineered to deter sulfur contamination
Absolute Tolerances to 1%
Completely lead free - RoHS compliant and halogen free
Comparable in cost to standard thick film chip resistors
Electrical Specifications
Type / Code
RNCP0402
RNCP0603
RNCP0805
Power Rating
(Watts) @ 70ºC
0.1W
0.125W
0.25W
(1)
Maximum Working
(2)
Voltage
50V
150V
Maximum Overload
Voltage
100V
300V
Resistance
Temperature
Coefficient
Ohmic Range (Ω) and
Tolerance
1%, 5%
1 - 10K
1 - 47K
1 - 100K
±100 ppm/ºC
200V
400V
RNCP1206
0.5W
(1) Power rating for each package size is valid if ambient temp ≤80°C and terminal temp ≤105°C
(2) Lesser of √PR or maximum working voltage
Certain resistance values will require a high minimum order quantity. Contact Stackpole Customer Service for details.
Please refer to the High Power Resistor Application Note (page 5) for more information on designing and implementing
high power resistor types.
Mechanical Specifications
Type / Code
RNCP0402
RNCP0603
RNCP0805
RNCP1206
L
Body Length
0.039 ± 0.004
1.00 ± 0.10
0.059 ± 0.004
1.50 ± 0.10
0.079 ± 0.006
2.00 ± 0.15
0.122 ± 0.008
3.10 ± 0.20
W
Body Width
0.020 ± 0.002
0.50 ± 0.05
0.031 ± 0.004
0.80 ± 0.10
0.049 ± 0.006
1.25 ± 0.15
0.059 ± 0.008
1.50 ± 0.20
H
Body Height
0.012 ± 0.002
0.30 ± 0.05
0.016 ± 0.004
0.40 ± 0.10
0.020 ± 0.004
0.50 ± 0.10
0.020 ± 0.004
0.50 ± 0.10
a
Top Termination
0.010 ± 0.006
0.25 ± 0.15
0.012 ± 0.008
0.30 ± 0.20
0.016 ± 0.008
0.40 ± 0.20
0.020 ± 0.012
0.50 ± 0.30
b
Bottom Termination
0.012 ± 0.006
0.30 ± 0.15
0.016 ± 0.008
0.40 ± 0.20
0.024 ± 0.008
0.60 ± 0.20
0.028 ± 0.008
0.70 ± 0.20
Unit
inches
mm
inches
mm
inches
mm
inches
mm
Rev Date: 10/23/2017
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
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RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Performance Characteristics
Test Items
Temperature Coefficient
of Resistance
Short Time Overload
High Temperature
Exposure (Storage)
Temperature Cycling
Reference Standard
MIL-STD-202F Method 304;
JIS-C5201-1-4.8
MIL-R-55342D Paragraph 4.7.5;
JIS-C5201-1-4.13
MIL-STD-202
Method 108
JESD22
Method JA-104
MIL-STD-202
Method 106
MIL-STD-202
Method 103
Condition of Test
+25~ +125ºC
2.5 X rated voltage for 5 s.
1000 h. @ T=125ºC. Unpowered.
Measurement at 24 ± 2 hours after test
conclusion.
1000 cycles (-55ºC to +125ºC) Measurement
at 24 ± 2 hours after test conclusion
1000 h., T=24 hours/cycle
Notes: Steps 7a & 7b not required.
Unpowered.
1000 h. 85ºC / 85% RH. Note: Specified
conditions: 10% of operating power.
Measurement at 24 ± 2 hours after test
conclusion
1000 h. TA=125ºC at rated power.
Measurement at 24 ± 2 hours after test
conclusion. Remark: Mounted quantity:
Mounted 2 pc. on 1 PCB
Condition B: Immerse the specimens in an
eutectic solder at 260 ± 5ºC for 10 ± 1s.
245 ± 5ºC solder, 2 ± 0.5 s. dwell
Solder: Sn96.5 / Ag3.0 / Cu0.5
3mm deflection
Pressure X kgf a R0.5 pressure rod for 60 s.
0201: NA
0402: 0.5Kg
0805: 1.0Kg
0603: 0.5Kg
1206: 1.8Kg
Test Limits (ΔR)
±100 ppm/ºC
F: ± (1% + 0.1Ω)
J: ± (2% + 0.1Ω)
F: ± (2% + 0.1Ω)
J: ± (2% + 0.1Ω)
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
Remark: R≤10Ω: F/J: ± (1% + 0.1Ω)
F: ± (1% + 0.05Ω)
J: ± (2% + 0.1Ω)
F: ± (3% + 0.1Ω)
J: ± (3% + 0.1Ω)
F: ± (1% + 0.05Ω)
J: ± (3% + 0.1Ω)
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
>95% area covered with tin
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
F: ± (0.5% + 0.05Ω)
J: ± (1% + 0.1Ω)
Moisture Resistance
Biased Humidity
Operational Life
MIL-STD-202
Method 108
MIL-STD-202
Method 210
J-STD-002
AEC-Q200-005
Resistance to Soldering
Heat
Solderability
Board Flex (Bending)
Terminal Strength (SMD)
AEC-Q200-006
Power Derating Curve:
100
80
-55ºC
70ºC
Power Load (%)
60
40
20
155ºC
0
-60
0
20
40
60
80
100
120
140
160
180
Ambient Temperature (ºC)
Rev Date: 10/23/2017
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
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RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Packaging Specifications
RNCP0402
(2mm Pitch Paper)
RNCP0603, 0805, 1206
(4mm Pitch Paper)
Type / Code
RNCP0402
RNCP0603
RNCP0805
RNCP1206
Type / Code
RNCP0402
RNCP0603
RNCP0805
RNCP1206
Paper Tape Pitch
0.079
2.00
0.157
4.00
0.157
4.00
0.157
4.00
P1
0.079 ± 0.004
2.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
A
0.028 ± 0.002
0.70 ± 0.05
0.043 ± 0.004
1.10 ± 0.10
0.063 ± 0.006
1.60
0.15
0.079 ± 0.006
2.00 ± 0.15
P2
0.079 ± 0.004
2.00 ± 0.10
0.079 ± 0.002
2.00 ± 0.05
0.079 ± 0.002
2.00 ± 0.05
0.079 ± 0.002
2.00 ± 0.05
B
0.047 ± 0.002
1.20 ± 0.05
0.075 ± 0.004
1.90 ± 0.10
0.094 ± 0.008
2.40 ± 0.20
0.142 ± 0.008
3.60 ± 0.20
P0
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
0.157 ± 0.004
4.00 ± 0.10
W
0.315 ± 0.008
8.00 ± 0.20
0.315 ± 0.008
8.00 ± 0.20
0.315 ± 0.008
8.00 ± 0.20
0.315 ± 0.008
8.00 ± 0.20
D0(ø
)
0.059 ± 0.004
1.50 ± 0.10
0.059 ± 0.004
1.50 ± 0.10
0.059 ± 0.004
1.50 ± 0.10
0.059 ± 0.004
1.50 ± 0.10
E
0.069 ± 0.004
1.75 ± 0.10
0.069 ± 0.004
1.75 ± 0.10
0.069 ± 0.004
1.75 ± 0.10
0.069 ± 0.004
1.75 ± 0.10
T
0.018 ± 0.004
0.45 ± 0.10
0.025 ± 0.004
0.64 ± 0.10
0.033 ± 0.004
0.84 ± 0.10
0.033 ± 0.004
0.84 ± 0.10
F
0.138 ± 0.002
3.50 ± 0.05
0.138 ± 0.002
3.50 ± 0.05
0.138 ± 0.002
3.50 ± 0.05
0.138 ± 0.002
3.50 ± 0.05
Unit
inches
mm
inches
mm
inches
mm
inches
mm
Unit
inches
mm
inches
mm
inches
mm
inches
mm
Rev Date: 10/23/2017
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
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marketing@seielect.com
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Reel Specifications
Type / Code
RNCP
ØA
7.008 ± 0.079
178.00 ± 2.00
ØB
2.362 ± 0.039
60.00 ± 1.00
Øc
0.512 ± 0.039
13.00 ± 1.00
W
0.354 ± 0.039
9.00 ± 1.00
T
0.453 ± 0.039
11.50 ± 1.00
Unit
inches
mm
Peel-off Force Specifications
Peel-off force of paper and blister tape is in accordance with “JIS-C5202”, that is, 0.1 to 0.7N at a
peel-off speed of 300 mm/minute.
Solder Land Pattern
Type / Code
0402
0603
0805
1206
A
0.016
0.40
0.026
0.65
0.039
1.00
0.079
2.00
B
0.059
1.50
0.083
2.10
0.118
3.00
0.165
4.20
C
0.024
0.60
0.035
0.90
0.051
1.30
0.063
1.60
Unit
inches
mm
inches
mm
inches
mm
inches
mm
Rev Date: 10/23/2017
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
4
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marketing@seielect.com
RNCP Series
High Power Anti-Sulfur Thin Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
High Power Chip Resistors and Thermal Management
Stackpole has developed several surface mount resistor series in addition to our current sense resistors,
which have had higher power ratings than standard resistor chips. This has caused some uncertainty and
even confusion by users as to how to reliably use these resistors at the higher power ratings in their designs.
The data sheets for the RHC, RMCP, RNCP, CSR, CSRN, CSRF, CSS, and CSSH state that the rated
power assumes an ambient temperature of no more than 100°C for the CSS / CSSH series and 70°C for all
other high power resistor series. In addition, IPC and UL best practices dictate that the combined
temperature on any resistor due to power dissipated and ambient air shall be no more than 105°C. At first
glance this wouldn’t seem too difficult, however the graph below shows typical heat rise for the CSR ½ 100
milliohm at full rated power. The heat rise for the RMCP and RNCP would be similar. The RHC with its
unique materials, design, and processes would have less heat rise and therefore would be easier to
implement for any given customer.
The 102°C heat rise shown here would indicate there will be additional thermal reduction techniques needed
to keep this part under 105°C total hot spot temperature if this part is to be used at 0.75 watts of power.
However, this same part at the usual power rating for this size would have a heat rise of around 72°C. This
additional heat rise may be dealt with using wider conductor traces, larger solder pads and land patterns
under the solder mask, heavier copper in the conductors, via through PCB, air movement, and heat sinks,
among many other techniques. Because of the variety of methods customers can use to lower the effective
heat rise of the circuit, resistor manufacturers simply specify power ratings with the limitations on ambient air
temperature and total hot spot temperatures and leave the details of how to best accomplish this to the
design engineers. Design guidelines for products in various market segments can vary widely so it would be
unnecessarily constraining for a resistor manufacturer to recommend the use of any of these methods over
another.
Note:
The final resistance value can be affected by the board layout and assembly process, especially the size of the
mounting pads and the amount of solder used. This is especially notable for resistance values ≤ 50mΩ.
This should be taken into account when designing.
Rev Date: 10/23/2017
This specification may be changed at any time without prior notice
Please confirm technical specifications before you order and/or use.
5
www.seielect.com
marketing@seielect.com
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