NAND Gate Based Peripheral Driver, 0.4A, BIPolar
| 参数名称 | 属性值 |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 输入特性 | STANDARD |
| 接口集成电路类型 | NAND GATE BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-CDFP-F |
| 功能数量 | 2 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | OPEN-COLLECTOR |
| 输出电流流向 | SINK |
| 标称输出峰值电流 | 0.4 A |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| 最大压摆率 | 71 mA |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子形式 | FLAT |
| 端子位置 | DUAL |
| 断开时间 | 0.035 µs |
| 接通时间 | 0.035 µs |
| Base Number Matches | 1 |
| SG75452BF | SG75462F | SG55462F/883B | SG55452BF | SG55452BF/883B | SG55462F | |
|---|---|---|---|---|---|---|
| 描述 | NAND Gate Based Peripheral Driver, 0.4A, BIPolar | NAND Gate Based Peripheral Driver, 0.4A, BIPolar | NAND Gate Based Peripheral Driver, 0.4A, BIPolar | NAND Gate Based Peripheral Driver, 0.4A, BIPolar | NAND Gate Based Peripheral Driver, 0.4A, BIPolar | NAND Gate Based Peripheral Driver, 0.4A, BIPolar |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 输入特性 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| 接口集成电路类型 | NAND GATE BASED PERIPHERAL DRIVER | NAND GATE BASED PERIPHERAL DRIVER | NAND GATE BASED PERIPHERAL DRIVER | NAND GATE BASED PERIPHERAL DRIVER | NAND GATE BASED PERIPHERAL DRIVER | NAND GATE BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-CDFP-F | R-CDFP-F | R-CDFP-F | R-CDFP-F | R-CDFP-F | R-CDFP-F |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 输出电流流向 | SINK | SINK | SINK | SINK | SINK | SINK |
| 标称输出峰值电流 | 0.4 A | 0.4 A | 0.4 A | 0.4 A | 0.4 A | 0.4 A |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 71 mA | 76 mA | 76 mA | 71 mA | 71 mA | 76 mA |
| 最大供电电压 | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 断开时间 | 0.035 µs | 0.065 µs | 0.065 µs | 0.035 µs | 0.035 µs | 0.065 µs |
| 接通时间 | 0.035 µs | 0.05 µs | 0.05 µs | 0.035 µs | 0.035 µs | 0.05 µs |
| 厂商名称 | - | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
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