Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, 0.150 INCH HEIGHT, DIP-14/8
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 其他特性 | INPUT TO 1ST TAP DELAY = 16NS; BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED |
| 系列 | CMOS/TTL |
| JESD-30 代码 | R-XDIP-P8 |
| 长度 | 20.32 mm |
| 逻辑集成电路类型 | ACTIVE DELAY LINE |
| 功能数量 | 1 |
| 抽头/阶步数 | 5 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 可编程延迟线 | NO |
| Prop。Delay @ Nom-Sup | 26 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 总延迟标称（td） | 26 ns |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| CMOSLDM-26T | CMOSLDM-125T | CMOSLDM-51T | CMOSLDM-100T | CMOSLDM-59T | CMOSLDM-80T | CMOSLDM-85T | CMOSLDM-90T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, 0.150 INCH HEIGHT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, 0.150 INCH HEIGHT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, 0.150 INCH HEIGHT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, 0.150 INCH HEIGHT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, 0.150 INCH HEIGHT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, 0.150 INCH HEIGHT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, 0.150 INCH HEIGHT, DIP-14/8 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, 0.150 INCH HEIGHT, DIP-14/8 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | INPUT TO 1ST TAP DELAY = 16NS; BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED | TAP TO TAP DELAY TOL.[NS] VARIES; BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED | INPUT TO 1ST TAP DELAY = 15NS; BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED | TAP TO TAP DELAY TOL.[NS] VARIES; BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED | INPUT TO 1ST TAP DELAY = 15NS; BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED | TAP TO TAP DELAY TOL.[NS] VARIES; BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED | TAP TO TAP DELAY TOL.[NS] VARIES; BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED | TAP TO TAP DELAY TOL.[NS] VARIES; BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED |
| 系列 | CMOS/TTL | CMOS/TTL | CMOS/TTL | CMOS/TTL | CMOS/TTL | CMOS/TTL | CMOS/TTL | CMOS/TTL |
| JESD-30 代码 | R-XDIP-P8 | R-XDIP-P8 | R-XDIP-P8 | R-XDIP-P8 | R-XDIP-P8 | R-XDIP-P8 | R-XDIP-P8 | R-XDIP-P8 |
| 长度 | 20.32 mm | 20.32 mm | 20.32 mm | 20.32 mm | 20.32 mm | 20.32 mm | 20.32 mm | 20.32 mm |
| 逻辑集成电路类型 | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 抽头/阶步数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程延迟线 | NO | NO | NO | NO | NO | NO | NO | NO |
| Prop。Delay @ Nom-Sup | 26 ns | 125 ns | 51 ns | 100 ns | 59 ns | 80 ns | 85 ns | 90 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 总延迟标称（td） | 26 ns | 125 ns | 51 ns | 100 ns | 59 ns | 80 ns | 85 ns | 90 ns |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
单片机
微控制器 MCU
微控制器 MCU
RF/无线
无线连接
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