IC 64K X 8 OTPROM, 200 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | QCCJ, LDCC32,.5X.6 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 200 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PQCC-J32 |
JESD-609代码 | e0 |
长度 | 13.995 mm |
内存密度 | 524288 bit |
内存集成电路类型 | OTP ROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC32,.5X.6 |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 3.56 mm |
最大待机电流 | 0.0001 A |
最大压摆率 | 0.015 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 11.455 mm |
Base Number Matches | 1 |
NM27LC512VE200 | NM27LC512T200 | NM27LC512T250 | NM27LC512TE150 | NM27LC512TE200 | NM27LC512TE250 | NM27LC512V250 | NM27LC512VE250 | NM27LC512VE150 | NM27LC512V200 | |
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描述 | IC 64K X 8 OTPROM, 200 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM | IC 64K X 8 OTPROM, 200 ns, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32, Programmable ROM | IC 64K X 8 OTPROM, 250 ns, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32, Programmable ROM | IC 64K X 8 OTPROM, 150 ns, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32, Programmable ROM | IC 64K X 8 OTPROM, 200 ns, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32, Programmable ROM | IC 64K X 8 OTPROM, 250 ns, PDSO32, 8 X 20 MM, EIAJ, PLASTIC, TSOP1-32, Programmable ROM | IC 64K X 8 OTPROM, 250 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM | IC 64K X 8 OTPROM, 250 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM | IC 64K X 8 OTPROM, 150 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM | IC 64K X 8 OTPROM, 200 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | QCCJ, LDCC32,.5X.6 | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 200 ns | 200 ns | 250 ns | 150 ns | 200 ns | 250 ns | 250 ns | 250 ns | 150 ns | 200 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 13.995 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 13.995 mm | 13.995 mm | 13.995 mm | 13.995 mm |
内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bi |
内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | - |
组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | QCCJ | QCCJ | QCCJ | QCCJ |
封装等效代码 | LDCC32,.5X.6 | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.56 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.56 mm | 3.56 mm | 3.56 mm | 3.56 mm |
最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
最大压摆率 | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 11.455 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 11.455 mm | 11.455 mm | 11.455 mm | 11.455 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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