SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
•
•
•
•
•
•
•
VR(max) = 600V
IF(avg) = 5A
VF(typ) = 1.5V
DLCC3 Hermetic Ceramic Surface Mount Package Designed as a
Drop In Replacement for “D-5B”/ “E-MELF” Package
†
No Reverse Recovery
No Forward Recovery
High Reliability Screening Options Available
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise stated)
VRRM
VRSM
IF(AVG)
IFSM
PD
TJ
Tstg
Peak Repetitive Reverse Voltage
Surge Peak Reverse Voltage
Average Forward Current
(1)
Non-Repetitive Peak Forward Surge Current
(3,4)
Total Power Dissipation at TA = 25°C
Derate Above TA = 25°C
Junction Temperature Range
Storage Temperature Range
600V
600V
5A
60A
2.96
(2)
14.8mW/°C
(2)
-55 to +225°C
-55 to +225°C
THERMAL PROPERTIES
Symbols
R
θJSP(IN)
R
θJA(PCB)
(2)
R
θJA(PCB)
(3)
Parameters
Thermal Resistance, Junction To Solder Pads TSP = 25°C
Thermal Resistance, Junction To Ambient, On PCB
Thermal Resistance, Junction To Ambient, On PCB
Max.
29
67.5
123
Units
°C/W
°C/W
°C/W
Notes
(1) IO1 is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to R
θJA(PCB)
≤
68°C/W.
(2)
(3)
PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air.
PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.
IO1 is rated at 1.0A @ TA = 25°C for PC boards where R
θJA(PCB)
≤
125°C/W. Derate at 7.33mA/°C above TA = 25°C in this case.
MIL-STD-750 Method 4066.4 Condition A1. I
O
= 1A, V
RWM
= 600V, V
RSM
= 600V, ten surges of 8.3mS each at 1 minute intervals, TA = 25°C.
(4)
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 9166
Issue 2
Page 1 of 6
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
Symbol
VF
(1)
Parameters
Diode Forward Voltage
Test Conditions
IF = 5A
IF = 5A
VR = 600V
VR = 600V
TJ = 25°C
TJ = 175°C
TJ = 25°C
TJ = 175°C
Min.
Typ.
1.5
2.0
50
100
Max.
1.8
2.4
200
1000
Unit
V
IR
Leakage Current
µA
DYNAMIC CHARACTERISTICS
QC
Total Capacitive Charge
VR = 600V
di/dt = 500A/µs
VR = 0V
CT
Junction Capacitance
(f = 1.0MHz)
VR = 200V
VR = 400V
Notes
(1) Pulse Width
≤
300us,
δ ≤
2%
IF = 5A
TJ = 25°C
TJ = 25°C
TJ = 25°C
TJ = 25°C
28
550
65
50
nC
pF
Semelab ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 9166
Issue 2
Page 2 of 6
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
Typical Performance Over Temperature Range
The Forward Characteristics of 600V D3A Diodes
12.0
10.0
If - Forward Current (A)
8.0
6.0
4.0
2.0
0.0
0
0.5
-55
25
1
1.5
175
225
2
2.5
Vf
dV
100
- For wa r
125
ol t a ge ( V )
150
Reverse Leakage characteristics of 600V D3A Diodes
18.0E-6
16.0E-6
14.0E-6
Reverse Current (A)
12.0E-6
10.0E-6
8.0E-6
6.0E-6
4.0E-6
2.0E-6
000.0E+
0
0
100
200
300
400
500
600
700
800
V R R ev er s e V ol t age ( V ol t s)
-55
25
100
125
150
175
225
Semelab ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 9166
Issue 2
Page 3 of 6
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
SiC Schottky Diode, no minority
SML05SC06D3
carrier recombination thus zero
reverse recovery. Recovery time
Equivalent Reverse Recovery Time Device
show n is due to a small junction
I
F
=500mA, I
R
= 1A, I
RR
=250mA
capacitance charge and is
independent of junction
temperature
1.000
0.500
0.000
C u rre n t(A )
-0.500
-1.000
-1.500
-1 8
-1 6
-1 4
-1 2
-1 0
-8
-6
-4
-2
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
Time (nS)
-55°C
0°C
25°C
50°C
100°C
150°C
200°C
225°C
Semelab ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 9166
Issue 2
Page 4 of 6
SiC SCHOTTKY DIODE
SML05SC06D3A / SML05SC06D3B
MECHANICAL DATA
A
D
DLCC3 Variant A (D3A)
PAD 1
PAD 2
DIMENSION
A
B
C
D
ANODE
CATHODE
mm
7.00 ±0.10
3.75 ±0.10
1.60 ±0.10
1.76 ±0.10
Inches
0.275 ±0.004
0.143 ±0.004
0.063 ±0.004
0.069 ±0.004
SML
D3A
C
C
1
2
A
B
D
DLCC3 Variant B (D3B)
PAD 1
PAD 2
PAD 3
DIMENSION
A
B
C
D
ANODE
CATHODE
LID CONTACT TO CATHODE*
mm
7.00 ±0.10
3.75 ±0.10
1.60 ±0.10
1.76 ±0.10
Inches
0.275 ±0.004
0.143 ±0.004
0.063 ±0.004
0.069 ±0.004
SML
D3B
C
C
1
2
3
* The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep
dielectric discharge in space applications; see the Space Weather link
www.semelab.co.uk/dlcc3.html
on the Semelab web site. Package variant
to be specified at order.
†
The DLCC3 package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology,
which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture
and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.
SOLDER PAD LAYOUT
)
*
A
B
C
mm
7.32
1.78
3.94
Inches
0.288
0.070
0.155
+
B
Soldering temperature should be 260°C for a
maximum of 10 seconds.
The physical dimensions for the DLCC3 ceramic package are designed
to be different from the published dimensions for the “D-5B” and “E-
MELF” outlines. The DLCC3 design fully utilises the recommended
solder footprint for the “D-5B” / “E-MELF” Package, and as such
presents a drop in replacement for existing board designs.
PACKAGE MASS
Gold Plated Solder Pad Finish = 150mg
Semelab ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 9166
Issue 2
Page 5 of 6
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