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SEAM-20-11.0-L-05-1-A-K-TR

产品描述Board Stacking Connector
产品类别连接器    连接器   
文件大小355KB,共1页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

SEAM-20-11.0-L-05-1-A-K-TR概述

Board Stacking Connector

SEAM-20-11.0-L-05-1-A-K-TR规格参数

参数名称属性值
Reach Compliance Codecompliant
ECCN代码EAR99
连接器类型BOARD STACKING CONNECTOR
Base Number Matches1

文档预览

下载PDF文档
F-215 (Rev 10JUL15)
SEAM–20–02.0–S–10–2–A–K–TR
SEAM–30–02.0–S–08–2–A–K–TR
SEAM–30–03.5–S–04–2–A–K–TR
(1.27 mm) .050"
SEAM SERIES
HIGH SPEED/HIGH DENSITY OPEN PIN FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55°C to +125°C
Current Rating
(7 mm stack height):
1.8 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Contact Resistance:
5.5 mΩ
Working Voltage:
240 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Mates with:
SEAF, SEAFP
Note:
Patented
Note:
Some sizes,
styles and options are
non-standard, non-returnable.
(1.15 mm)
.045"
NOMINAL
WIPE
Up to 500
Pins
5, 8 and 10 row footprint
compatible with SamArray
®
.
Samples recommended.
Solder
charges
Low
insertion/
extraction
forces
Rated @ 3dB Insertion Loss
w/o PCB effects*
Single-Ended Signaling
18 GHz / 36 Gbps
Differential Pair Signaling
18 GHz / 36 Gbps
*Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?SEAM or contact sig@samtec.com
SEAM/SEAF
10 mm Stack Height
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
SEAM
ry
dust ds
In
ar
tand
S
ols
otoc ted
Pr or
Supp
100 GbE
nel
Fibre Chan
O
Rapid I/
®
s
PCI Expres
SATA
InfiniBand
PISMO 2
VITA 47
VITA 57
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
A
K
–A
TR
–L
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–10, –15, – 20,
– 30, –40, –50
(–10 only available in 04 row)
(–15 only available in 10 row)
NO. OF
ROWS
–04
–05, –06
–08
–10
– 04
=Four Rows
(–06.5 not
available)
–1
= Tin/Lead Alloy
Solder Charge
= Alignment Pins
(Required. Arrays
will not self-center
on solder pads)
B
(7.06) .278
(9.60) .378
(12.14) .478
(14.68) .578
01
–S
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
– 05
=Five Rows
(–06.5 not
available)
–2
= Lead-Free
Solder Charge
–K
= Polyimide film
Pick & Place Pad
– TR
=Tape & Reel
– 06
=Six Rows
(–06.5 not
available)
notes at
Download app ppnote
com/a
www.samtec.
m
@ samtec.co
Contact SIG n protocols
o
for questions
– 08
(1.27)
.050
=Eight Rows
DIFFERENTIAL
(1.27) .050
(1.27)
.050
B
– 10
=Ten Rows
08
PAIR
ARRAY COUNT
40x8
40x6
30x10
30x8
30x6
20x10
20x8
20x5
80
60
75
60
45
50
40
25
MATED HEIGHTS
SEAM SEAF LEAD STYLE
LEAD
STYLE –05.0 –06.0 –06.5
8 mm 8.5 mm
–02.0
7 mm
9 mm 9.5 mm
–03.0
8 mm
–03.5
8.5 mm 9.5 mm 10 mm
–06.5
11.5 mm 12.5 mm 13 mm
–07.0
12 mm 13 mm 13.5 mm
–09.0
14 mm 15 mm 15.5 mm
–11.0
16 mm 17 mm 17.5 mm
No. of positions x (1.27) .050 + (4.98) .196
(1.02)
.040
(1.27)
.050
A
LEAD
STYLE
–02.0
–03.0
–03.5
–06.5
–07.0
–09.0
–11.0
A
(4.60) .181
(5.59) .220
(6.10) .240
(9.14) .360
(9.60) .378
(11.60) .457
(13.60) .535
PAIR
ARRAY COUNT
50x10
50x8
40x10
125
100
100
(1.02)
.040
(0.86)
(1.12)
(1.27)
.034
.044
.050
DIA
DIA
No. of positions x (1.27) .050 + (3.58) .141
(0.10)
.004
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
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