Telecom Circuit, CMOS, PDIP20,
| 参数名称 | 属性值 |
| 包装说明 | DIP, DIP20(UNSPEC) |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDIP-T20 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20(UNSPEC) |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 3/12 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| HT614(20DIP) | HT692(18DIP) | HT604L(20DIP) | A12KV-DG | HT614(20SOP) | |
|---|---|---|---|---|---|
| 描述 | Telecom Circuit, CMOS, PDIP20, | Telecom Circuit, CMOS, PDIP18, | Telecom Circuit, CMOS, PDIP20, | General Specifications | Telecom Circuit, CMOS, PDSO20, |
| 包装说明 | DIP, DIP20(UNSPEC) | DIP, DIP18(UNSPEC) | DIP, DIP20(UNSPEC) | - | SOP, SOP20(UNSPEC) |
| Reach Compliance Code | unknown | unknown | unknown | - | unknown |
| JESD-30 代码 | R-PDIP-T20 | R-PDIP-T18 | R-PDIP-T20 | - | R-PDSO-G20 |
| 端子数量 | 20 | 18 | 20 | - | 20 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | - | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | - | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | - | SOP |
| 封装等效代码 | DIP20(UNSPEC) | DIP18(UNSPEC) | DIP20(UNSPEC) | - | SOP20(UNSPEC) |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | - | SMALL OUTLINE |
| 电源 | 3/12 V | 3/12 V | 3/12 V | - | 3/12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 表面贴装 | NO | NO | NO | - | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | - | TELECOM CIRCUIT |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL |
| 厂商名称 | - | Holtek(合泰) | Holtek(合泰) | - | Holtek(合泰) |
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