Ball / Land Grid Array Sockets
Twist Lock Type
E-tec is now the leading BGA socket manufacturer.
EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries.
Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed
and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional
board space. The 1.27mm pitch screw lock socket extends
≈
6,00 mm beyond the outer ball row with
no fixing holes.
We aim to solve your requirements - many different terminals and configurations are available.
Your custom sets our standards!
Please note, we will always request the chip data to ensure we offer a compatible socket.
SMT Style
Important Note:
Please check the ball diameters & heights of your chip prior to
ordering the standard E-tec BGA (BPW, BCW) sockets. Any deviation
has to be communicated to E-tec in order to check compatibility with
the standard socket design and if necessary to obtain a special order
code adapted to your chip dimensions.
The standard solderball diameters & heights are the following:
Pitch
ball
diameters
ball
height
min/max
min/max
0.50mm
0.25mm / 0.35mm
0.15mm / 0.30mm
0.65mm
0.25mm / 0.45mm
0.15mm / 0.30mm
0.75mm
0.25mm / 0.45mm
0.15mm / 0.40mm
0.80mm
0.40mm / 0.55mm
0.25mm / 0.45mm
1.00mm
0.50mm / 0.70mm
0.30mm / 0.50mm
1.27mm & 1.50mm
a) plastic chips (
BPW)
0.60mm / 1.00mm
0.50mm / 0.70mm
b) ceramic chips
(BCW)
0.60mm / 1.00mm
0.80mm / 1.00mm
If the minimum ball diameter of a given chip falls below the above
indications, then a BUW socket will generally be proposed.
Mechanical data
Specifications
10.000 cycles min.
1.000 cycles min.
exceeds MIL-STD-202 Method 208
40 grams max.
up to 800 pins = 7cNm or 10 oz-inch
as of 800 pins = 7cNm to 10cNm or 10 oz
to 14 oz-inch
High temp plastic or epoxy FR4
Brass
BeCu
PCB Pad Layout
Ø 0,60mm/.024“ if pitch 1,27mm
Ø 0,50mm/.020“ if pitch 1,00mm
Ø 0,40mm/.016“ if pitch 0,80mm
Ø 0,35mm/.014“ if pitch 0,75mm
Ø 0,35mm/.014“ if pitch 0,65mm
Ø 0,30mm/.012“ if pitch 0,50mm
You may request any specific socket dimension from
info@e-tec.com
For top view socket dimension
pls. ref. to separate catalog page
Soldertail Style
Soldertail:
Ø 0,42mm/.016”
Ø 0,29mm/.011”
Ø 0,29mm/.011”
Ø 0,27mm/.010”
Ø 0,27mm/.010”
Ø 0,27mm/.010”
if pitch 1,27mm
if pitch 1,00mm
if pitch 0,80mm
if pitch 0,75mm
if pitch 0,65mm
if pitch 0,50mm
Contact life
Retention System life
Solderability
Individual contact force
Max. torque for retention screws
Material
PCB Hole Layout
PCB solder hole:
Ø 0,60mm/.024”
Ø 0,50mm/.020”
Ø 0,40mm/.016”
Ø 0,35mm/.014”
Ø 0,35mm/.014”
Ø 0,35mm/.014”
if pitch 1,27mm
if pitch 1,00mm
if pitch 0,80mm
if pitch 0,75mm
if pitch 0,65mm
if pitch 0,50mm
Insulator
(RoHS compliant)
Terminal
(RoHS compliant)
Contact
(RoHS compliant)
Electrical data
Contact resistance
< 100 m
Ω
Current rating
500 mA max.
Insulation resistance at 500V DC 100 MΩ if 0.50 to 0.80mm pitch
500 MΩ 1.00mm pitch upwards
500V min.
Breakdown voltage at 60 Hz
< 1 pF
Capacitance
< 2 nH
Inductance
Operating temperature
Torque limiting screw driver
Solder paste
Solder profile
−55°C
to
+125°C
; 260°C for 60 sec.
Recommendations
The pitch dimension depends on your Ball Grid Array
Refer to page “Tools” of this catalog
Please use a solder paste w/o any silver!
Please refer to our website
www.e-tec.com
X X W x x x x - x x x x - x x X X
95
Device Type
B
=
Ball Grid
L
=
Land Grid
C
=
Column Grid
How to order
L
optional for locating pegs
Device Material
C
=
std. socket for
P
U
ceramic device
Pitch
05
06
07
08
=
=
=
=
0,50mm
0,65mm
0,75mm
0,80mm
10
= 1,00mm
12
= 1,27mm
15
= 1,50mm
Grid Code Config Code
will be given by the factory
after receipt of the chip
datasheet
Plating
95
= tin/gold
(tin leadfree)
=
std. socket for
plastic device
=
socket adapted to
small diameter solderballs
others on
request
Nbr of contacts
depends on
ballcount of chip
30
29
28
70
=
=
=
=
Contact Type
standard SMT...
( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm pitch, 0.60 if 0,80mm pitch; 0,40mm if <0.80mm pitch )
raised SMT..
( „A“ = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm pitch; 2,80mm if 0,80mm pitch, 2.30mm if <0.80mm pitch )
special raised SMT - only for 1.00 & 0.80mm pitch….....
( „A“ = 4,50mm )
standard solder tail……..…...….
( „A“ = 3.30 if 1.27mm pitch, 2.80 if 1.00mm or 0.80mm pitch, 2,30mm if <0.80mm pitch )
8
Socket Mounting Recommendations and Reflow Profile
Purpose
This document is meant to serve as a guide for mounting E-tec surface mount device (SMD)
sockets to the printed circuit board (PCB). The recommendations described here are guidelines
only, and modifications may be needed for your particular socket, PCB, and process.
Application
The sockets this document applies to are as follows: Clam Shell, Knob Lock, Screw Lock, Twist
Lock, Quick Lock and Lever Lock in SMD style. These sockets utilize the E-tec patented spring-
pin technology. This technology allows the pins to be soldered to the PCB while still providing
compliance to the device under test (DUT) via springs located at the other end of the pin. The
pins themselves do not have solder pre-forms as a BGA would with its solder balls. However, the
sockets are designed to mount to the same PCB footprint and pads as required by the BGA, or
any other IC package the socket was designed for (except if locating pegs are used; see ‘Locating
Pegs’ section of this document). When compared to mounting a BGA, an extra volume of solder
paste is required to mount the sockets to the PCB. To effect this, a properly dimensioned stencil
is required. Once the paste has been applied, a standard reflow process is then used to solder the
socket to the PCB. After the socket is verified to have proper electrical connection to the PCB,
the system is then ready to be used.
Locating Pegs
Although designed to mount to the same footprint as the IC, with just a small amount of
additional keep-out area, E-tec sockets can also be offered with locating pegs. The sockets are
typically mounted with two locating pegs, which require two thru-holes drilled into the PCB.
These pegs help to align the socket on the PCB, and hence align the socket’s pins to the PCB’s
pads, during the soldering process. Furthermore, plating the thru-holes allows the locating pegs
to be soldered to the PCB for better mechanical stability during everyday use and handling of the
socket. If the PCB design permits, E-tec recommends the use of these locating pegs. For fine-
pitch, low pin-count sockets without locating pegs, the mechanical strength of the solder joints
may be insufficient. In these cases, it is recommended to epoxy the socket body to the PCB. 3M
Scotch-Weld 2216 B/A is a suitable epoxy. In any case, the proper volume of solder paste is
required to ensure mechanical and electrical integrity. Recommended stencil dimensions are
given in the next section of this document.
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
Phone +41-21-781 08 10 ·
www.e-tec.com
·
info@e-tec.com
E-tec Socket Mounting Recommendations
PRELIMINARY
1
Socket Mounting Recommendations and Reflow Profile
Stencil
Table 1 shows the recommended stencil dimensions. A laser-cut, electro-polished and Ni-plated
stainless steel stencil is recommended to give the most consistent paste release. The apertures
can be made round except for smaller pitches, where square apertures are recommended.
Remember to keep the stencil small enough to fit within the keep-out area of the socket, but yet
have provisions to remove it from the PCB once the paste has been applied.
Table 1: Recommended stencil dimensions.
Device Pitch
(mm)
1.27
1.00
0.80
0.75
0.65
0.50
PCB Pad Diameter
(mm / in)
min. 0.60 / 0.023
min. 0.50 / 0.019
min. 0.40 / 0.016
min. 0.35 / 0.014
min. 0.35 / 0.014
min. 0.30 / 0.012
Stencil Thickness
(mm/in)
0.15 / 0.006
0.15 / 0.006
0.13 / 0.005
0.13 / 0.005
0.13 / 0.005
0.13 / 0.005
Stencil Aperture
(mm/in)
round 0.66 / 0.026
round 0.55 / 0.022
round 0.44 / 0.017
square 0.39 / 0.015
square 0.39 / 0.015
square 0.33 / 0.013
Solder Paste
E-tec recommends using solder paste without ( or <0.5%) silver (Ag) to reduce the solder’s
wetting ability and prevent the paste from running up the pins, thus maximizing the volume of
solder left on the pads. Brands such as Qualitek (www.qualitek.com) or Alpha Metals
(www.alphametals.com) produce such solder paste on customer request. For Sn/Pb solder paste
we recommend Ecorel 803S offered by Avantec (www.avantec.dehon.com).
Reflow Profile
Both standard Sn-Pb eutectic and Pb-free reflow profiles are shown below.
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
Phone +41-21-781 08 10 ·
www.e-tec.com
·
info@e-tec.com
E-tec Socket Mounting Recommendations
PRELIMINARY
2
Socket Mounting Recommendations and Reflow Profile
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland
Phone +41-21-781 08 10 ·
www.e-tec.com
·
info@e-tec.com
E-tec Socket Mounting Recommendations
PRELIMINARY
3
FPGA/CPLD
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