FREQUENCY
QESM08
SMD
2.5x2.0
Crystal – Ceramic SMD packaged
Specification (Rev-A)
Electrical Characteristics ......................................................P01
ESR vs. frequency range and Mode of vibration ..................P01
Mechanical Characteristics ...................................................P01
Ordering Information .............................................................P02
Suggested Reflow Soldering profile ......................................P02
Tape Drawing........................................................................P03
Reel Drawing ........................................................................P03
Frequency
QESM08
Specification (rev-A)
SMD
2.5x2.0
Crystal – Ceramic SMD packaged
Electrical Characteristics
Electrical Parameters
Frequency range
Temperature Stability
Operating Temperature Range
Storage temperature range
Shunt capacitance C
0
Load capacitance
Drive level
Aging (First Year)
Insulator resistance
Unit
MHz
± ppm
°C
°C
pF
pF
µW
± ppm
MΩ
500
8pF ~ 12pF
50
100
2
Ref at 25°C
At 100V
DC
-40
Minimum Typical Maximum
16
10
10
-20/+70
60
50
50
-40/+85
+85
3.0
January
25
th
, 2008
Test conditions
Refer to Ordering Information
Refer to Ordering Information
Refer to Ordering Information
Frequency Tolerance
(at 25°C) ± ppm
Refer to Ordering Information
Customized specification upon request
ESR vs. frequency range and Mode of vibration
Frequency range (MHz)
16.000 to 19.999
20.000 to 29.999
30.000 to 60.000
Mode of vibration
Fundamental (AT-cut)
Fundamental (AT-cut)
Fundamental (AT-cut)
Max ESR (Ω)
120
80
50
Mechanical Characteristics
Marking for QESM08
Line 1 Temex code (3 digits)
Line 2 T+date code (2digits)
Mechanical conditions
Vibration 10g, 10Hz to 2KHz
according to standard
CEI 68-2-63
Shocks
100g, 6ms according
to standard CEI 68-2-
27
Note 1 :
Pin 2 and Pin 4 are
connected through cover. In case
connected to GND, frequency
might be drifted.
H = 0.55 Max
Note 2 :
QESM08 is fully RoHS
compliant.
1
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM08
Specification (rev-A)
SMD
2.5x2.0
Crystal – Ceramic SMD packaged
Ordering Information
QESM08
1
Part numbering system
10
HQ
10
10
January 25
th
, 2008
26.0000MHZ
Package type
Vibration
mode
1=Fundamental
Frequency
tolerance
Operating
temperature
range
Frequency
stability
Load
Capacitance
10=10pF
Please, enter the
value of load
capacitance
Nominal
Frequency
(MHz)
Please enter the
nominal
frequency
SMD Package
QESM08 :
SMD
ceramic
2.5
x
2.0
10=±10ppm
20=±20ppm
30=±30ppm
50=±50ppm
D=-40°C
F= -30°C
H=-20°C
J=-10°C
L=0°C
M=+50°C
N=+55°C
O=+60°C
Q=+70°C
T=+85°C
10=±10ppm
20=±20ppm
30=±30ppm
50=±50ppm
Suggested Reflow Soldering Profile
2
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM08
Specification (rev-A)
SMD
2.5x2.0
Crystal – Ceramic SMD packaged
Tape Drawing
January 25
th
, 2008
Item
Pitch of components
Pitch of sprocket hole
Length from hole center to component center
Width of carrier tape
Width of adhesive tape
Height of component hole
Width of component hole
Gap of hold down tape and carrier tape
Diameter of sprocket hole
Diameter of feed hole
Total of tape thickness
Code
P
Po
P1
W
W0
A
B
W2
Do
D1
K
Dimension
4.0
4.0
2.0
8.0
3.5
2.8
2.3
Tolerance
± 0.1
± 0.1
± 0.1
± 0.3
± 0.1
± 0.1
± 0.1
± 0.1
± 0.05
± 0.25
± 0.1
0.5
∅
1.5
∅
1.5
1.0
Reel Drawing
9.5
2.5
Ø21.6
Ø13.5
Multiple
:
3000pcs
per reel
Ø 178
1.6
Ø 60
3
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Microchip MCU
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