IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 包装说明 | SON, SOLCC8,.11,20 |
| Reach Compliance Code | compliant |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010000R |
| JESD-30 代码 | R-PDSO-N8 |
| 内存密度 | 2048 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SON |
| 封装等效代码 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.00005 A |
| 最大压摆率 | 0.003 mA |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 写保护 | HARDWARE |
| Base Number Matches | 1 |
| CAT1026ZD4I-28-GT2 | CAT1026ZD4I-45-GT2 | CAT1026ZD4I-42-GT2 | CAT1027ZD4I-30-GT3 | CAT1027ZD4I-42-GT3 | CAT1027ZD4I-42-GT2 | CAT1027ZD4I-45-GT3 | CAT1027ZD4I-45-GT2 | CAT1026ZD4I-30-GT2 | CAT1026ZD4I-30-GT3 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC | IC,SERIAL EEPROM,256X8,CMOS,LLCC,8PIN,PLASTIC |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R | 1010000R |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
| 内存密度 | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SON | SON | SON | SON | SON | SON | SON | SON | SON | SON |
| 封装等效代码 | SOLCC8,.11,20 | SOLCC8,.11,20 | SOLCC8,.11,20 | SOLCC8,.11,20 | SOLCC8,.11,20 | SOLCC8,.11,20 | SOLCC8,.11,20 | SOLCC8,.11,20 | SOLCC8,.11,20 | SOLCC8,.11,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 电源 | 3.3 V | 5 V | 5 V | 3.3 V | 5 V | 5 V | 5 V | 5 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 0.00005 A | 0.00005 A | 0.00005 A | 0.00006 A | 0.00006 A | 0.00006 A | 0.00006 A | 0.00006 A | 0.00005 A | 0.00005 A |
| 最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 标称供电电压 (Vsup) | 3.3 V | 5 V | 5 V | 3.3 V | 5 V | 5 V | 5 V | 5 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| 厂商名称 | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | - | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
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