8-BIT, OTPROM, MICROCONTROLLER, PQCC28
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | QCCJ, |
| Reach Compliance Code | unknown |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 5 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQCC-J28 |
| 长度 | 11.5062 mm |
| I/O 线路数量 | 13 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| ROM可编程性 | OTPROM |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.5062 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Base Number Matches | 1 |
| TMS370C702FNA | SE370C702FZA | TMS370C702FNL | SE370C702JNA | SE370C702FZL | SE370C702JNT | SE370C702JNL | |
|---|---|---|---|---|---|---|---|
| 描述 | 8-BIT, OTPROM, MICROCONTROLLER, PQCC28 | 8-BIT, UVPROM, MICROCONTROLLER, CQCC28 | 8-BIT, OTPROM, MICROCONTROLLER, PQCC28 | 8-BIT, UVPROM, MICROCONTROLLER, CDIP64 | 8-BIT, UVPROM, MICROCONTROLLER, CQCC28 | 8-BIT, UVPROM, MICROCONTROLLER, CDIP64 | 8-BIT, UVPROM, MICROCONTROLLER, CDIP64 |
| 包装说明 | QCCJ, | QCCJ, | QCCJ, | DIP, | QCCJ, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 具有ADC | YES | YES | YES | YES | YES | YES | YES |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-PQCC-J28 | S-CQCC-J28 | S-PQCC-J28 | R-CDIP-T64 | S-CQCC-J28 | R-CDIP-T64 | R-CDIP-T64 |
| I/O 线路数量 | 13 | 13 | 13 | 13 | 13 | 13 | 13 |
| 端子数量 | 28 | 28 | 28 | 64 | 28 | 64 | 64 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 105 °C | 70 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | - | -40 °C | - |
| PWM 通道 | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ | QCCJ | QCCJ | DIP | QCCJ | DIP | DIP |
| 封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | OTPROM | UVPROM | OTPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | QUAD | QUAD | QUAD | DUAL | QUAD | DUAL | DUAL |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 长度 | 11.5062 mm | 11.24 mm | 11.5062 mm | - | 11.24 mm | - | - |
| 座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | - | 4.57 mm | - | - |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | - | - |
| 宽度 | 11.5062 mm | 11.24 mm | 11.5062 mm | - | 11.24 mm | - | - |
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