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SKIIP402GDL061-460U

产品描述Full Bridge Based Peripheral Driver, 413A
产品类别模拟混合信号IC    驱动程序和接口   
文件大小30KB,共2页
制造商SEMIKRON
官网地址http://www.semikron.com
下载文档 详细参数 选型对比 全文预览

SKIIP402GDL061-460U概述

Full Bridge Based Peripheral Driver, 413A

SKIIP402GDL061-460U规格参数

参数名称属性值
厂商名称SEMIKRON
包装说明,
Reach Compliance Codeunknown
ECCN代码EAR99
内置保护TRANSIENT; OVER CURRENT; THERMAL
接口集成电路类型FULL BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码R-XXMA-X
功能数量1
最高工作温度85 °C
最低工作温度-25 °C
输出电流流向SOURCE AND SINK
标称输出峰值电流413 A
封装主体材料UNSPECIFIED
封装形状RECTANGULAR
封装形式MICROELECTRONIC ASSEMBLY
认证状态Not Qualified
表面贴装NO
温度等级OTHER
端子形式UNSPECIFIED
端子位置UNSPECIFIED
Base Number Matches1

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SKiiP 3-phase bridge
Absolute Maximum Ratings
Symbol
V
isol 4)
T
op
,T
stg
Conditions
AC, 1min
Operating / stor. temperature
1)
Values
2500
-25...+85
600
400
400
-40...+150
400
800
4000
80
18
30
20
75
Units
V
°C
V
V
A
°C
A
A
A
kAs
2
V
V
kHz
kV/µs
IGBT and Inverse Diode
V
CES
V
CC 5)
Operating DC link voltage
I
C
IGBT
3)
T
j
IGBT + Diode
I
F
Diode
I
FM
Diode, t
p
< 1 ms
I
FSM
Diode, T
j
= 150 °C, 10ms; sin
2
I t (Diode) Diode, T
j
= 150 °C, 10ms
Driver
V
S1
Stabilized Power Supply
V
S2
Non-stabilized Power Supply
f
smax
Switching frequency
dV/dt
Primary to secondary side
SKiiPPACK
®
SK integrated intelligent
Power PACK
3-phase bridge with
brake chopper
SKiiP
7,9)
402 GDL 061 - 460 CTV
Preliminary Data
Case S5
Characteristics
Symbol
IGBT
11)
V
(BR)CES
I
CES
V
TO
r
T
V
Cesat
V
Cesat
E
on
+ E
off
C
CHC
L
CE
Conditions
1)
min.
≥V
CES
typ.
6
0,8
15
max.
0,4
0,94
4,2
2,6
2,60
36/51
1,72
1,75
12
0,78
2,5
0,100
0,188
36
Units
V
mA
mA
V
mΩ
V
V
mJ
nF
nH
V
V
mJ
V
mΩ
K/W
K/W
K/KW
mA
mA
µs
A
A
°C
V
Driver without supply
V
GE
= 0,
T
j
= 25 °C
V
CE
= V
CES
T
j
= 125 °C
T
j
= 125 °C
T
j
= 125 °C
I
C
= 400A,
T
j
= 125 °C
I
C
= 400A,
T
j
= 25 °C
V
CC
=300/400V,I
C
=400A
T
j
= 125 °C
per SkiiP, AC side
Top, Bottom
T
j
= 125 °C
T
j
= 25 °C
T
j
= 125 °C
Inverse Diode
2)
V
F
= V
EC
I
F
= 400A;
V
F
= V
EC
I
F
= 400A
E
on
+ E
off
I
F
= 400A;
V
TO
T
j
= 125 °C
r
T
T
j
= 125 °C
Features
Short circuit protection, due to
evaluation of current sensor
signals
Isolated power supply
Low thermal impedance
Optimal thermal management
with integrated heatsink
Pressure contact technology
with increased power cycling
capability, compact design
Low stray inductance
High power, small losses
Over-temperature protection
1)
2)
3)
4)
Thermal Characteristics
R
thjs10)
per IGBT
10)
R
thjs
per Diode
6,10)
R
thsa
P16 heatsink; see case S5
Driver
I
S1
Supply current 15V-supply
I
S2
Supply current 24V-supply
t
interlock-driver
Interlock-time
SKiiPPACK protection
I
TRIPSC
Short circuit protection
I
TRIPLG
Ground fault protection
T
TRIP
Over-temp. protection
9)
U
DCTRIP
U
DC
-protection
Mechanical Data
M1
DC terminals, SI Units
M2
AC terminals, SI Units
5)
6)
7)
340+490*f
s
/f
smax
+3,5*I
AC
/A
250+360*f
s
/f
smax
+2,6*I
AC
/A
2,3
413
96
115
410
4
8
11.01.99
6
10
9)
10)
11)
T
heatsink
= 25 °C, unless
otherwise specified
CAL = Controlled Axial Lifetime
Technology (soft and fast)
without driver
Driver input to DC link /
AC output to DC link / AC
output to heatsink
with Semikron-DC link (low
inductance)
other heatsinks on request
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
options available for driver:
U - DC link voltage sense
F – Fiber optic connector
s
” referenced to temperature
sensor
NPT-technology with homo-
genous current-distribution
Nm
Nm
©by
SEMIKRON

SKIIP402GDL061-460U相似产品对比

SKIIP402GDL061-460U SKIIP402GDL061-460CTV SKIIP402GDL061-460F
描述 Full Bridge Based Peripheral Driver, 413A Half Bridge Based Peripheral Driver, 413A Full Bridge Based Peripheral Driver, 413A
厂商名称 SEMIKRON SEMIKRON SEMIKRON
Reach Compliance Code unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99
内置保护 TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL TRANSIENT; OVER CURRENT; THERMAL
接口集成电路类型 FULL BRIDGE BASED PERIPHERAL DRIVER HALF BRIDGE BASED PERIPHERAL DRIVER FULL BRIDGE BASED PERIPHERAL DRIVER
JESD-30 代码 R-XXMA-X R-XXMA-X R-XXMA-X
功能数量 1 1 1
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -25 °C -25 °C -25 °C
输出电流流向 SOURCE AND SINK SOURCE AND SINK SOURCE AND SINK
标称输出峰值电流 413 A 413 A 413 A
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified
表面贴装 NO NO NO
温度等级 OTHER OTHER OTHER
端子形式 UNSPECIFIED UNSPECIFIED UNSPECIFIED
端子位置 UNSPECIFIED UNSPECIFIED UNSPECIFIED
Base Number Matches 1 1 1

 
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