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IR21362C

产品描述MOSFET Driver, CMOS,
产品类别模拟混合信号IC    驱动程序和接口   
文件大小267KB,共32页
制造商International Rectifier ( Infineon )
官网地址http://www.irf.com/
下载文档 详细参数 全文预览

IR21362C概述

MOSFET Driver, CMOS,

IR21362C规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称International Rectifier ( Infineon )
包装说明, DIE OR CHIP
Reach Compliance Codeunknown
最高工作温度125 °C
最低工作温度-40 °C
封装等效代码DIE OR CHIP
电源15 V
认证状态Not Qualified
标称供电电压15 V
技术CMOS
温度等级AUTOMOTIVE
Base Number Matches1

文档预览

下载PDF文档
Data Sheet No. PD65000
IR2136C/IR21362C/IR21363C/IR21365C/
IR21366C/IR21367C/IR21368C
3-PHASE BRIDGE DRIVER DIE IN WAFER FORM
Features
100 % Tested at Probe
Available in Chip Pack, Unsawn Wafer, Sawn on Film
Floating channel designed for bootstrap operation
Fully operational to +600V
Tolerant to negative transient voltage - dV/dt immune
Gate drive supply range from 10 to 20V (IR2136C/IR21368C), 11.5 to 20V (IR21362C) or 12 to 20V
(IR21363C/IR21365C/IR21366C/IR21367C)
Undervoltage lockout for all channels
Over-current shutdown turns off all six drivers
Independent 3 half-bridge drivers
Matched propagation delay for all channels
Cross-conduction prevention logic
Lowside outputs out of phase with inputs. High side outputs out of phase (IR2136C/IR21363C/IR21365C/
IR21366C/IR21367C/IR21368C) or in phase (IR21362C) with inputs.
3.3V logic compatible
Lower di/dt gate driver for better noise immunity
Externally programmable delay for automatic fault clear
up to 600V
VCC
HIN1,2,3 / HIN1,2,3
LIN1,2,3
HO1,2,3
FAULT
FAULT
EN
VS1,2,3
TO
LOAD
LO1,2,3
COM
VB1,2,3
Typical Connection
VCC
HIN1,2,3 / HIN1,2,3
LIN1,2,3
(Refer to the Die Outlines
for correct pin configura-
tion).
This/These
diagram(s) show electri-
cal connections only.
Please refer to our Appli-
cation
Notes
and
DesignTips for proper cir-
cuit board layout.
EN
RCIN
ITRIP
VSS
IR2136(2)(3)(5)(6)(7)(8)
GND
Note:
This IR product is100% tested at wafer level and is manufactured using established, mature and well characterized
processes. Due to restrictions in die level processing, die may not be equivalent to standard package products and are
therefore offered with a conditional performance guarantee. The above data sheet is based on IR sample testing under
certain predetermined and assumed conditions, and are provided for illustration purposes only. Customers are encouraged
to perform testing in actual proposed packaged and use conditions. IR die products are tested using IR-based quality
assurance procedures and are manufactured using IR’s established processes. Programs for customer-specified testing
are available upon request. IR has experienced assembly yields of generally 95% or greater for individual die; however,
customer’s results will vary. Estimates such as those described and set forth in this data sheet for semiconductor die will
vary depending on a number of packaging, handling, use and other factors. Sold die may not perform on an equivalent
basis to standard package products and are therefore offered with a limited warranty as described in IR’s applicable
standard terms and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale,
which are available upon request. For customers requiring a particular parameter to be guaranteed, special testing can be
carried out or product can be purchased as known good die.
Part number shown is for die in wafer. Contact factory for these other options.
www.irf.com
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