Multiplier Accumulator/Summer, CMOS, PDIP64
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Fairchild |
包装说明 | DIP, DIP64,.9 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDIP-T64 |
JESD-609代码 | e0 |
端子数量 | 64 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP64,.9 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
认证状态 | Not Qualified |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
Base Number Matches | 1 |
TMC2210N0C80 | TMC2210N0C95 | TMC2210G8C65 | TMC2210J0V95 | TMC2210H8C80 | TMC2210G8V95 | |
---|---|---|---|---|---|---|
描述 | Multiplier Accumulator/Summer, CMOS, PDIP64 | Multiplier Accumulator/Summer, CMOS, PDIP64, | Multiplier Accumulator/Summer, CMOS, CPGA68 | Multiplier Accumulator/Summer, CMOS, CDIP64, | Multiplier Accumulator/Summer, CMOS, PPGA68, | Multiplier Accumulator/Summer, CMOS, CPGA68, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
Reach Compliance Code | unknown | compliant | unknown | compliant | compliant | compli |
JESD-30 代码 | R-PDIP-T64 | R-PDIP-T64 | S-XPGA-P68 | R-XDIP-T64 | S-PPGA-P68 | S-XPGA-P68 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 64 | 64 | 68 | 64 | 68 | 68 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
封装代码 | DIP | DIP | PGA | DIP | PGA | PGA |
封装等效代码 | DIP64,.9 | DIP64,.9 | PGA68,11X11 | DIP64,.9 | PGA68,11X11 | PGA68,11X11 |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE |
封装形式 | IN-LINE | IN-LINE | GRID ARRAY | IN-LINE | GRID ARRAY | GRID ARRAY |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | PIN/PEG | THROUGH-HOLE | PIN/PEG | PIN/PEG |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | PERPENDICULAR | DUAL | PERPENDICULAR | PERPENDICULAR |
uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
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