电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SSW-140-06-H-Q-RA

产品描述Board Connector, 80 Contact(s), 2 Row(s), Female, Right Angle, Solder Terminal, Socket,
产品类别连接器    连接器   
文件大小527KB,共3页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

SSW-140-06-H-Q-RA概述

Board Connector, 80 Contact(s), 2 Row(s), Female, Right Angle, Solder Terminal, Socket,

SSW-140-06-H-Q-RA规格参数

参数名称属性值
厂商名称SAMTEC
Reach Compliance Codecompliant
ECCN代码EAR99
主体/外壳类型SOCKET
连接器类型BOARD CONNECTOR
联系完成配合GOLD (30)
联系完成终止GOLD (3)
触点性别FEMALE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e4
MIL 符合性NO
制造商序列号SSW-1
混合触点NO
安装方式RIGHT ANGLE
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距2.54 mm
端接类型SOLDER
触点总数80
UL 易燃性代码94V-0
Base Number Matches1

文档预览

下载PDF文档
REVISION BX
SSW-1XX-XX-XXX-X-XX-XXX-XX
No OF POSITIONS
-01 THRU -50
(-P OPTION: 36 POS MAX)
DO NOT
SCALE FROM
THIS PRINT
LEAD STYLE
(SEE TABLE 1)
-01 THRU -06 (STD. INS. FORCE)
-21 THRU -24 (LOW INS. FORCE)
OPTION
-LL: LOCKING LEAD
(SEE FIG 4, SHT 2)
(N/A IN SINGLE ROW,
1 & 2 POSITION)
POLARIZING OPTION
INDICATE POS, SEE FIG 3, SHT 3
OPTION
-RA: RIGHT ANGLE (SEE FIG 2, SHT 2)
(STYLE -01 & -21 N/A)
-N: NOTCH (SEE FIG 6, SHT 3)
(ONLY AVAILABLE IN -D ROW)
(ONLY AVAILABLE IN 5, 7, 8, 10, 12,
13, 15, 17, 20, 25, 32, 36 POSITIONS)
(USE NSW-XX-D-N-XX BODY,
SEE TABLE 6)
PLATING SPECIFICATION
-G: 20µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
-T: MATTE TIN CONTACT AND TAIL
(CONTACT -21 THRU -24 N/A)
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-H: 30µ" HEAVY GOLD IN CONTACT AREA,
ROW SPECIFICATION
3µ" GOLD ON TAIL
-E: 50µ" EXTRA HEAVY GOLD IN CONTACT AREA,
-S: SINGLE
3µ" GOLD ON TAIL
-D: DOUBLE
(CONTACT -01 & -02 STRAIGHT ONLY)
-T: TRIPLE
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT AREA,
-P: SINGLE
MATTE TIN ON TAIL
-Q: TRIPLE WITH ONLY OUTER 2 ROWS
-STL: 30µ" SELECTIVE GOLD IN CONTACT AREA,
FILLED
TIN/LEAD (90/10 ± 5%) TAIL
-TL: TIN/LEAD (90/10 ± 5%) CONTACT AND TAIL
(AVAILABLE ONLY ON LEAD STYLES -01)
-TM: MATTE TIN CONTACT AND TAIL (CONTACT -21 THRU -24 N/A)
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-FM: 3µ" FLASH GOLD SELECTIVE IN CONTACT AREA,
MATTE TIN ON TAIL
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
.050 1.27 REF
((No. OF POS x .10[2.5]) + .02[0.5])
SEE NOTE 10
.0110 0.280
REF
.095 2.41
REF
.095 2.41
REF
.245 6.22
.195 4.95
REF
SEE NOTE 8
.295 7.49
REF
60°
.335 8.51
DETAIL 'A'
SCALE 4 : 1
SEE NOTE 5
NOTES:
'A'
*"B"
.031 0.79 X .016[0.41]
REF (TYP)
+.000
*"B"
- .005
FOR
C
C
-S
MACHINE FILL ONLY
-P
.100 2.54
C
-D
FIG 1
-D-N
.100 2.54
.200 5.08
-T
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MAXIMUM CUT FLASH: .015[.38] WITH NO FLASH BELOW STANDOFFS OR IN CONTACT HOLES.
3. MINIMUM CONTACT PUSHOUT FORCE: 1.5 LBS.
4. MAXIMUM ALLOWABLE BOW: .003[.08] INCH/INCH.
5. MAXIMUM ALLOWABLE SWAY: 2° (TYP) FOR HAND FILL & 1° (TYP) FOR MACHINE FILL.
6. MAXIMUM ALLOWABLE VARIATION BETWEEN ROWS: .010[.25].
7. "END WALLS" AFTER CUTTING SHOULD BE .020±.003 [.51±.08].
8. NOTCH ON -P-RA & -D-RA-N OPTIONS TO BE ORIENTED AS SHOWN.
9. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION.
10. SHEAR LOCATION TO BE WITHIN .001[.03] OF THE BREAK OFF CENTER LOCATION
FOR MACHINE FILL.
11. LEAD STYLE X2 (SINGLE AND DOUBLE) -RA's TO BE LAYER PACKAGED. ALL OTHER -RA
LEAD STYLES: UNDER 5 POSITION TO BE LAYER PACKAGED, 5 AND UP TO BE PACKAGED
IN TUBES.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
.XXX: .005 [.13]
ANGLES
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
INSULATOR:
-S, -D, -D-N: VECTRA E130i, COLOR: BLACK UL94 V0
-P, -T: PCT, COLOR: BLACK UL94 V0
CONTACT: PHOSPHOR BRONZE, SPRING TEMPER
ALLOY 511 OR 510
(TENSILE STRENGTH 90-100 KSI)
(YEILD STRENGTH @ 2% OFFSET 88-98 KSI)
PER MIL-B-13501
THICKNESS: .0160±.001 [0.635±0.03]
F:\DWG\MISC\MKTG\SSW-1XX-XX-XXX-X-XX-XXX-XX-MKT.SLDDRW
SHEET SCALE: 2:1
ASSEMBLY, SOCKET STRIP .016 X .031 TAIL
SSW-1XX-XX-XXX-X-XX-XXX-XX
06/12/1987
SHEET
1
OF
3
BY:
PURVIS
艾睿电子线上研讨会:英特尔FPGA深度学习加速技术 直播资料合集
直播资料合集 艾睿电子线上研讨会:英特尔FPGA深度学习加速技术 直播回放: >>点击观看 直播文档: >>点击下载 直播问答: ......
EEWORLD社区 FPGA/CPLD
STM32发送显示数据给串口工业屏的问题,麻烦各位大大来给指导下,万分感谢。。
其实就是用STM32和串口工业屏通信,我写好了数据接收函数,现在是要写发送函数。 但是他给的协议表是这样的: 95077 void Uart1_PutStr1(u8 *p,u8 len) { extern UART_TypeDef Uart1_St ......
fbi987996 stm32/stm8
中兴通讯电源输入端口的电磁兼容设计
中兴通讯电源输入端口的电磁兼容设计...
linda_xia 模拟电子
恩智浦充分挖掘多功能汽车钥匙的潜能
推出市场就绪型NFC“智能”汽车钥匙 中国上海,2011年6月15日 --" 智能"汽车钥匙市场的先驱--恩智浦半导体NXP Semiconductors N.V. (NASDAQ:NXPI) 今日宣布推出针对多功能汽车 ......
恩智浦半导体 汽车电子
WinCE 3G卡 USB驱动 求救
dear all: 小弟最近做一个HW的3G卡,WinCE下的USB虚拟串口驱动,在USB中,有8组接口,用了其它的一组有2个端点,8号端点OUT写数据,88号端点IN读取数据,为什么能写成功,IN不到数据呢,望大家 ......
toutou13 嵌入式系统
采用TPS767D301 作为28335内核与IO口供电芯片的问题?
当用TPS767D301 作为28335内核与IO口供电芯片的时候为什么,内核电压与IO口电压之间要并联一个肖特基二极管? 网上给出的解释是:保护 DSP,我看到VDDIO输入电压最大范围-0.3V到2.5V,VDD最 ......
shuai 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2424  1643  493  438  1990  58  59  23  38  19 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved