Parallel I/O Port, 24 I/O, HMOS, CDIP48, SIDE BRAZED, CERAMIC, DIP-48
| 参数名称 | 属性值 |
| 厂商名称 | Thales Group |
| 零件包装代码 | DIP |
| 包装说明 | , |
| 针数 | 48 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| JESD-30 代码 | R-CDIP-T48 |
| I/O 线路数量 | 24 |
| 端口数量 | 3 |
| 端子数量 | 48 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | HMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE |
| Base Number Matches | 1 |
| TS68230MC1B8 | TS68230VE8 | TS68230CE8 | TS68230MC1C8 | TS68230ME1C8 | TS68230ME8 | TS68230ME1B8 | |
|---|---|---|---|---|---|---|---|
| 描述 | Parallel I/O Port, 24 I/O, HMOS, CDIP48, SIDE BRAZED, CERAMIC, DIP-48 | Parallel I/O Port, 24 I/O, HMOS, CQCC52, CERAMIC, LCC-52 | Parallel I/O Port, 24 I/O, HMOS, CQCC52, CERAMIC, LCC-52 | Parallel I/O Port, 24 I/O, HMOS, CDIP48, SIDE BRAZED, CERAMIC, DIP-48 | Parallel I/O Port, 24 I/O, HMOS, CQCC52, CERAMIC, LCC-52 | Parallel I/O Port, 24 I/O, HMOS, CQCC52, CERAMIC, LCC-52 | Parallel I/O Port, 24 I/O, HMOS, CQCC52, CERAMIC, LCC-52 |
| 零件包装代码 | DIP | LCC | LCC | DIP | LCC | LCC | LCC |
| 针数 | 48 | 52 | 52 | 48 | 52 | 52 | 52 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-CDIP-T48 | S-CQCC-N52 | S-CQCC-N52 | R-CDIP-T48 | S-CQCC-N52 | S-CQCC-N52 | S-CQCC-N52 |
| I/O 线路数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 端口数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 48 | 52 | 52 | 48 | 52 | 52 | 52 |
| 最高工作温度 | 125 °C | 85 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES | YES |
| 技术 | HMOS | HMOS | HMOS | HMOS | HMOS | HMOS | HMOS |
| 温度等级 | MILITARY | INDUSTRIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD | QUAD |
| uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
| 厂商名称 | Thales Group | - | Thales Group | Thales Group | Thales Group | Thales Group | Thales Group |
| 筛选级别 | MIL-STD-883 Class B | - | - | MIL-STD-883 Class B | MIL-STD-883 Class B | - | MIL-STD-883 Class B |
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